Part Details for X66AK2H06AAAW2 by Texas Instruments
Overview of X66AK2H06AAAW2 by Texas Instruments
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for X66AK2H06AAAW2
X66AK2H06AAAW2 CAD Models
X66AK2H06AAAW2 Part Data Attributes:
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X66AK2H06AAAW2
Texas Instruments
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X66AK2H06AAAW2
Texas Instruments
Multicore DSP+ARM KeyStone II System-on-Chip (SoC) 1517-FCBGA 0 to 85
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| Pbfree Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 1517 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 24 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 156.25 MHz | |
| External Data Bus Width | 16 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B1517 | |
| Length | 40 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 1517 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Seated Height-Max | 3.75 mm | |
| Speed | 1200 MHz | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 40 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |