Part Details for X3G-OH047 by NXP Semiconductors
Overview of X3G-OH047 by NXP Semiconductors
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- Part Data Attributes: (Available)
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Applications
Consumer Electronics
Security and Surveillance
Environmental Monitoring
Internet of Things (IoT)
Space Technology
Smart Cities
Aerospace and Defense
Healthcare
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Robotics and Drones
Part Details for X3G-OH047
X3G-OH047 CAD Models
X3G-OH047 Part Data Attributes:
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X3G-OH047
NXP Semiconductors
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Datasheet
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X3G-OH047
NXP Semiconductors
Magnetic Field Sensor, MAGNETIC FIELD SENSOR-MAGNETORESISTIVE
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Part Life Cycle Code | End Of Life | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | DIE OR CHIP | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Body Breadth | 1.15 mm | |
Body Length or Diameter | 2.36 mm | |
Operating Temperature-Max | 150 °C | |
Operating Temperature-Min | -40 °C | |
Output | BRIDGE | |
Output Type | VOLTAGE OUTPUT | |
Package Equivalence Code | DIE OR CHIP | |
Package Shape/Style | RECTANGULAR | |
Resistance | 3200 Ω | |
Sensors/Transducers Type | MAGNETIC FIELD SENSOR,MAGNETORESISTIVE | |
Supply Voltage-Max | 9 V | |
Technology | HYBRID |