Part Details for X28C010F-25 by Renesas Electronics Corporation
Overview of X28C010F-25 by Renesas Electronics Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Renewable Energy
Robotics and Drones
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
X28C010FI-15 | Rochester Electronics LLC | EEPROM |
Part Details for X28C010F-25
X28C010F-25 CAD Models
X28C010F-25 Part Data Attributes
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X28C010F-25
Renesas Electronics Corporation
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Datasheet
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X28C010F-25
Renesas Electronics Corporation
EEPROM, 128KX8, 250ns, Parallel, CMOS, CDFP32
|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Package Description | DFP, FL32,.5 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Access Time-Max | 250 ns | |
Command User Interface | NO | |
Data Polling | YES | |
JESD-30 Code | R-XDFP-F32 | |
Memory Density | 1048576 bit | |
Memory IC Type | EEPROM | |
Memory Width | 8 | |
Number of Terminals | 32 | |
Number of Words | 131072 words | |
Number of Words Code | 128000 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 128KX8 | |
Package Body Material | CERAMIC | |
Package Code | DFP | |
Package Equivalence Code | FL32,.5 | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK | |
Page Size | 256 words | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Standby Current-Max | 0.0005 A | |
Supply Current-Max | 0.05 mA | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | FLAT | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Toggle Bit | YES |