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Memory EEPROMs X28C010DI

Memory
X28C010DI
Description: 128KX8 EEPROM 5V, CDIP32, CERAMIC, DIP-32

Overview of X28C010DI by Intersil Corporation

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
  • Distributor Offerings: ( 0 listings )
  • Number of FFF Equivalents: ( 0 replacements )
  • CAD Models: ( Request Part )
  • Number of Functional Equivalents: ( 10 options )
  • Part Data Attributes ( Available )
  • Reference Designs: ( Not Available )
Where used in Applications: Industrial Automation Computing and Data Storage Financial Technology (Fintech) Telecommunications Renewable Energy Robotics and Drones

CAD Models for X28C010DI by Intersil Corporation
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Part Data Attributes for X28C010DI by Intersil Corporation
Parametric Data

X28C010DI
Intersil Corporation
Buy Now
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
INTERSIL CORP
Part Package Code
DIP
Package Description
DIP, DIP32,.6
Pin Count
32
Reach Compliance Code
not_compliant
ECCN Code
EAR99
HTS Code
8542.32.00.51
Command User Interface
NO
Data Polling
YES
JESD-30 Code
R-GDIP-T32
JESD-609 Code
e0
Memory Density
1048576 bit
Memory IC Type
EEPROM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
131072 words
Number of Words Code
128000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
128KX8
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
DIP
Package Equivalence Code
DIP32,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE
Page Size
256 words
Parallel/Serial
PARALLEL
Programming Voltage
5 V
Qualification Status
Not Qualified
Seated Height-Max
5.92 mm
Standby Current-Max
0.0005 A
Supply Current-Max
0.05 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Toggle Bit
YES
Width
15.24 mm
Write Cycle Time-Max (tWC)
10 ms
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  1. X28C010DI
    Intersil Corporation
    128KX8 EEPROM 5V, CDIP32, CERAMIC, DIP-32
    VS

Alternate Parts for X28C010DI

This table gives cross-reference parts and alternative options found for X28C010DI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of X28C010DI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
CY27C64-150JC OTP ROM, 8KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32 Rochester Electronics LLC X28C010DI vs CY27C64-150JC
MX27C4100MC-90 OTP ROM, 512KX8, 90ns, CMOS, PDSO40, PLASTIC, SOP-40 Macronix International Co Ltd X28C010DI vs MX27C4100MC-90
MX27C1024MC-55 OTP ROM, 64KX16, 55ns, CMOS, PDSO40, 0.450 INCH, PLASTIC, MO-099, SOP-40 Macronix International Co Ltd X28C010DI vs MX27C1024MC-55
AT27LV256R-30JI Memory IC Microchip Technology Inc X28C010DI vs AT27LV256R-30JI
AM28F010-70EI Flash, 128KX8, 70ns, PDSO32, TSOP-32 Rochester Electronics LLC X28C010DI vs AM28F010-70EI
M27C405-150B1 512KX8 OTPROM, 150ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 STMicroelectronics X28C010DI vs M27C405-150B1
AT27C512R-15LC UVPROM, 64KX8, 150ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 Atmel Corporation X28C010DI vs AT27C512R-15LC
AM28F010-200C3DEB Flash Rochester Electronics LLC X28C010DI vs AM28F010-200C3DEB
E28F320S5-90 Flash, 4MX8, 90ns, PDSO56, 14 X 20 MM, TSOP-56 Intel Corporation X28C010DI vs E28F320S5-90
AM28F010-200DEB Flash, 128KX8, 200ns, CDIP32, HERMETIC SEALED, CERAMIC, DIP-32 Rochester Electronics LLC X28C010DI vs AM28F010-200DEB

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