Part Details for X25057MIG-1.8 by IC Microsystems Sdn Bhd
Overview of X25057MIG-1.8 by IC Microsystems Sdn Bhd
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for X25057MIG-1.8
X25057MIG-1.8 CAD Models
X25057MIG-1.8 Part Data Attributes:
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X25057MIG-1.8
IC Microsystems Sdn Bhd
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Datasheet
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X25057MIG-1.8
IC Microsystems Sdn Bhd
EEPROM, 512X8, Serial, CMOS, PDSO8, ROHS COMPLIANT, MSOP-8
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | IC MICROSYSTEMS SDN BHD | |
| Part Package Code | MSOP | |
| Package Description | TSSOP, | |
| Pin Count | 8 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Clock Frequency-Max (fCLK) | 3.3 MHz | |
| JESD-30 Code | S-PDSO-G8 | |
| Length | 3 mm | |
| Memory Density | 4096 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 512 words | |
| Number of Words Code | 512 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512X8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.07 mm | |
| Serial Bus Type | SPI | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 1.8 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 3 mm | |
| Write Cycle Time-Max (tWC) | 10 ms |
Alternate Parts for X25057MIG-1.8
This table gives cross-reference parts and alternative options found for X25057MIG-1.8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of X25057MIG-1.8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| X25057M-1.8T1 | EEPROM, 512X8, Serial, CMOS, PDSO8, MSOP-8 | Xicor Inc | X25057MIG-1.8 vs X25057M-1.8T1 |
| X25057MI-1.8 | EEPROM, 512X8, Serial, CMOS, PDSO8, MSOP-8 | Xicor Inc | X25057MIG-1.8 vs X25057MI-1.8 |
| X25057M-1.8 | EEPROM, 512X8, Serial, CMOS, PDSO8, MSOP-8 | IC Microsystems Sdn Bhd | X25057MIG-1.8 vs X25057M-1.8 |
| X25057MI-1.8T1 | EEPROM, 512X8, Serial, CMOS, PDSO8, MSOP-8 | Xicor Inc | X25057MIG-1.8 vs X25057MI-1.8T1 |
| X25057MG-1.8 | EEPROM, 512X8, Serial, CMOS, PDSO8, ROHS COMPLIANT, MSOP-8 | IC Microsystems Sdn Bhd | X25057MIG-1.8 vs X25057MG-1.8 |