Datasheets
WSF128K16-37G1UC by:

Memory Circuit, Flash+SRAM, 128KX16, CMOS, CQFP68, 22.40 MM, CERAMIC, QFP-68

Part Details for WSF128K16-37G1UC by White Electronic Designs Corp

Overview of WSF128K16-37G1UC by White Electronic Designs Corp

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Applications Energy and Power Systems

Part Details for WSF128K16-37G1UC

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WSF128K16-37G1UC Part Data Attributes

WSF128K16-37G1UC White Electronic Designs Corp
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WSF128K16-37G1UC White Electronic Designs Corp Memory Circuit, Flash+SRAM, 128KX16, CMOS, CQFP68, 22.40 MM, CERAMIC, QFP-68
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer WHITE ELECTRONIC DESIGNS CORP
Package Description 22.40 MM, CERAMIC, QFP-68
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 70 ns
Additional Feature SRAM IS ORGANISED AS 128K X 16 OR 256K X 8; FLASH CAN ALSO BE ORGANISED AS 256K X 8
JESD-30 Code S-CQFP-G68
JESD-609 Code e0
Length 23.88 mm
Memory Density 2097152 bit
Memory IC Type MEMORY CIRCUIT
Memory Width 16
Mixed Memory Type FLASH+SRAM
Number of Functions 1
Number of Terminals 68
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 128KX16
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code QFP
Package Equivalence Code QFP68,.99SQ,50
Package Shape SQUARE
Package Style FLATPACK
Qualification Status Not Qualified
Seated Height-Max 3.56 mm
Standby Current-Max 0.04 A
Supply Current-Max 0.36 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position QUAD
Width 23.88 mm

Alternate Parts for WSF128K16-37G1UC

This table gives cross-reference parts and alternative options found for WSF128K16-37G1UC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WSF128K16-37G1UC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
WSF128K32-22H2MA Memory Circuit, Flash+SRAM, 128KX32, CMOS, CPGA66, CERAMIC, HIP-66 White Electronic Designs Corp WSF128K16-37G1UC vs WSF128K32-22H2MA
ACT-SF512K16N-26P7Q Memory Circuit, 512KX16, CMOS, CPGA66, 1.080 X 1.080 INCH, 0.185 INCH HEIGHT, HERMETIC SEALED, CERAMIC, PGA-66 Cobham PLC WSF128K16-37G1UC vs ACT-SF512K16N-26P7Q
WSF512K32-27H2IA Memory Circuit, 512KX32, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, PGA-66 Microsemi Corporation WSF128K16-37G1UC vs WSF512K32-27H2IA
WSF512K32-29H2CA Memory Circuit, 512KX32, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, PGA-66 Mercury Systems Inc WSF128K16-37G1UC vs WSF512K32-29H2CA
5962-9690101HXA Memory Circuit, 512KX16, CMOS, CHIP66, White Microelectronics WSF128K16-37G1UC vs 5962-9690101HXA
WSF512K16-72H2IA Memory Circuit, 512KX16, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, PGA-66 Microsemi Corporation WSF128K16-37G1UC vs WSF512K16-72H2IA
5962-9690001H9X Memory Circuit, 128KX16, CMOS, CQFP68, 22.40 X 22.40 MM, HERMETIC SEALED, CERAMIC, QFP-68 Microsemi Corporation WSF128K16-37G1UC vs 5962-9690001H9X
5962-9690001HYA Memory Circuit, 128KX16, CMOS, PGA-66 Microsemi Corporation WSF128K16-37G1UC vs 5962-9690001HYA
WSE128K16-73H1I Memory Circuit, 128KX16, CMOS, CPGA66, 1.075 X 1.075 INCH, PGA TYPE, HERMETIC SEALED, CERAMIC, HIP-66 Mercury Systems Inc WSF128K16-37G1UC vs WSE128K16-73H1I
WSF512K16-72H2MA Memory Circuit, 512KX16, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, PGA-66 Microsemi Corporation WSF128K16-37G1UC vs WSF512K16-72H2MA

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