Datasheets
WS128K32N-100G2C by: White Electronic Designs Corp

SRAM Module, 128KX32, 100ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68

Part Details for WS128K32N-100G2C by White Electronic Designs Corp

Overview of WS128K32N-100G2C by White Electronic Designs Corp

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Part Details for WS128K32N-100G2C

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WS128K32N-100G2C Part Data Attributes:

WS128K32N-100G2C White Electronic Designs Corp
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WS128K32N-100G2C White Electronic Designs Corp SRAM Module, 128KX32, 100ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer WHITE ELECTRONIC DESIGNS CORP
Package Description 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
Reach Compliance Code unknown
Access Time-Max 100 ns
JESD-30 Code S-CQFP-G68
JESD-609 Code e4
Length 22.4 mm
Memory Density 4194304 bit
Memory IC Type SRAM MODULE
Memory Width 32
Number of Functions 1
Number of Terminals 68
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 128KX32
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code QFP
Package Shape SQUARE
Package Style FLATPACK
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish GOLD
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position QUAD
Width 22.4 mm

Alternate Parts for WS128K32N-100G2C

This table gives cross-reference parts and alternative options found for WS128K32N-100G2C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WS128K32N-100G2C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
WS128K32N-100G4TC SRAM Module, 128KX32, 100ns, CMOS, CQFP68, 40 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68 White Electronic Designs Corp WS128K32N-100G2C vs WS128K32N-100G4TC
WS128K32N-100G4TIA SRAM Module, 128KX32, 100ns, CMOS, CQFP68, 40 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68 White Electronic Designs Corp WS128K32N-100G2C vs WS128K32N-100G4TIA
WS128K32-100H1MA SRAM Module, 128KX32, 100ns, CMOS, CPGA66, 1.075 X 1.075 MM, CERAMIC, PGA-66 White Electronic Designs Corp WS128K32N-100G2C vs WS128K32-100H1MA
WS128K32-100H1I SRAM Module, 128KX32, 100ns, CMOS, CPGA66, 1.075 X 1.075 MM, CERAMIC, PGA-66 White Electronic Designs Corp WS128K32N-100G2C vs WS128K32-100H1I
WS128K32-100H1M SRAM Module, 128KX32, 100ns, CMOS, CPGA66, 1.075 X 1.075 MM, CERAMIC, PGA-66 White Electronic Designs Corp WS128K32N-100G2C vs WS128K32-100H1M
WS128K32N-100G2I SRAM Module, 128KX32, 100ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp WS128K32N-100G2C vs WS128K32N-100G2I
WS128K32N-100G2M SRAM Module, 128KX32, 100ns, CMOS, CQFP68, 22.40 X 22.40 MM, 5.08 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 White Electronic Designs Corp WS128K32N-100G2C vs WS128K32N-100G2M
WS128K32N-100G2UQ SRAM Module, 128KX32, 100ns, CMOS, CQFP68, 22.40 X 22.40 MM, 4.57 MM HEIGHT, CERAMIC, QFP-68 White Electronic Designs Corp WS128K32N-100G2C vs WS128K32N-100G2UQ
WS128K32N-100G4TQ SRAM Module, 128KX32, 100ns, CMOS, CQFP68, 40 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68 White Electronic Designs Corp WS128K32N-100G2C vs WS128K32N-100G4TQ
WS128K32N-100G2UIA SRAM Module, 128KX32, 100ns, CMOS, CQFP68, 22.40 X 22.40 MM, 4.57 MM HEIGHT, CERAMIC, QFP-68 White Electronic Designs Corp WS128K32N-100G2C vs WS128K32N-100G2UIA

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