Datasheets
WPN252012H1R0MT by: Sunlord

General Purpose Inductor, 1uH, 20%, 1 Element, Ferrite-Core, SMD, 1008, CHIP

Part Details for WPN252012H1R0MT by Sunlord

Results Overview of WPN252012H1R0MT by Sunlord

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Applications Consumer Electronics

WPN252012H1R0MT Information

WPN252012H1R0MT by Sunlord is a Fixed Inductor.
Fixed Inductors are under the broader part category of Inductors.

Inductors are passive components that resist sudden changes in current by storing and releasing energy in an electromagnetic fiel. They are often used in power circuits and energy storage. Read more about Inductors on our Inductors part category page.

Price & Stock for WPN252012H1R0MT

Part # Distributor Description Stock Price Buy
DISTI # 3442-WPN252012H1R0MTCT-ND
DigiKey FIXED IND 1UH 3A 54 MOHM SMD Min Qty: 1 Lead time: 16 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) Temporarily Out of Stock
  • 1 $0.3300
  • 10 $0.2730
  • 25 $0.2524
  • 50 $0.2378
  • 100 $0.2242
  • 250 $0.2074
  • 500 $0.1955
  • 1,000 $0.1843
  • 2,000 $0.1738
  • 4,000 $0.1639
  • 6,000 $0.1584
  • 10,000 $0.1517
  • 14,000 $0.1474
  • 20,000 $0.1430
  • 50,000 $0.1375
$0.1375 / $0.3300 Buy Now
Win Source Electronics FIXED IND 1UH 3A 54 MOHM SMD 18000
  • 705 $0.0712
  • 1,710 $0.0585
  • 2,655 $0.0566
  • 3,650 $0.0548
  • 4,720 $0.0530
  • 6,320 $0.0475
$0.0475 / $0.0712 Buy Now

Part Details for WPN252012H1R0MT

WPN252012H1R0MT CAD Models

WPN252012H1R0MT Part Data Attributes

WPN252012H1R0MT Sunlord
Buy Now Datasheet
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WPN252012H1R0MT Sunlord General Purpose Inductor, 1uH, 20%, 1 Element, Ferrite-Core, SMD, 1008, CHIP
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Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer SHENZHEN SUNLORD ELECTRONICS CO LTD
Package Description CHIP
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8504.50.80.00
Samacsys Manufacturer SUNLORD
Case/Size Code 1008
Construction Wirewound
Core Material FERRITE
DC Resistance 0.054 Ω
Inductance-Nom (L) 1 µH
Inductor Application POWER INDUCTOR
Inductor Type GENERAL PURPOSE INDUCTOR
Number of Functions 1
Number of Terminals 2
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Height 1.2 mm
Package Length 2.5 mm
Package Style SMT
Package Width 2 mm
Packing Method TR, Embossed, 7 Inch
Rated Current-Max 3 A
Self Resonance Frequency 52 MHz
Shape/Size Description RECTANGULAR PACKAGE
Shielded YES
Surface Mount YES
Terminal Placement DUAL ENDED
Terminal Shape ONE SURFACE
Test Frequency 1 MHz
Tolerance 20%

Alternate Parts for WPN252012H1R0MT

This table gives cross-reference parts and alternative options found for WPN252012H1R0MT. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WPN252012H1R0MT, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
BDCL002520121R0MS1 Chilisin Electronics Corp Check for Price General Purpose Inductor, WPN252012H1R0MT vs BDCL002520121R0MS1
BDCD002520121R0MS1 Chilisin Electronics Corp Check for Price General Purpose Inductor, WPN252012H1R0MT vs BDCD002520121R0MS1
BDCD002520121R0MS1 Pulse Electronics Corporation Check for Price General Purpose Inductor, 1uH, 20%, 1 Element, SMD, 1008, CHIP WPN252012H1R0MT vs BDCD002520121R0MS1

WPN252012H1R0MT Frequently Asked Questions (FAQ)

  • The recommended land pattern for WPN252012H1R0MT is a rectangular pad with a size of 2.5mm x 1.2mm, with a solder mask opening of 2.2mm x 1.0mm.

  • To handle thermal management, ensure good airflow around the component, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K, and consider using a heat sink or thermal pad.

  • The maximum operating temperature range for WPN252012H1R0MT is -40°C to 125°C, with a storage temperature range of -40°C to 150°C.

  • To ensure reliability in high-vibration environments, use a secure mounting method, such as soldering or adhesive bonding, and consider using a vibration-dampening material or potting compound.

  • The recommended reflow soldering profile for WPN252012H1R0MT is a peak temperature of 260°C, with a ramp-up rate of 3°C/s, a dwell time of 30-60 seconds, and a cool-down rate of 6°C/s.