Part Details for WEDPZ512K72V-150BM by White Electronic Designs Corp
Overview of WEDPZ512K72V-150BM by White Electronic Designs Corp
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Part Details for WEDPZ512K72V-150BM
WEDPZ512K72V-150BM CAD Models
WEDPZ512K72V-150BM Part Data Attributes:
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WEDPZ512K72V-150BM
White Electronic Designs Corp
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WEDPZ512K72V-150BM
White Electronic Designs Corp
ZBT SRAM, 512KX72, 3.8ns, CMOS, PBGA152, 17 X 23 MM, PLASTIC, BGA-152
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | WHITE ELECTRONIC DESIGNS CORP | |
| Package Description | 17 X 23 MM, PLASTIC, BGA-152 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 3.8 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| JESD-30 Code | R-PBGA-B152 | |
| Length | 23 mm | |
| Memory Density | 37748736 bit | |
| Memory IC Type | ZBT SRAM | |
| Memory Width | 72 | |
| Number of Functions | 1 | |
| Number of Terminals | 152 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 512KX72 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.2 mm | |
| Supply Voltage-Max (Vsup) | 3.465 V | |
| Supply Voltage-Min (Vsup) | 3.135 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 17 mm |