Part Details for WEDPS512K32V-12BC by White Electronic Designs Corp
Overview of WEDPS512K32V-12BC by White Electronic Designs Corp
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Part Details for WEDPS512K32V-12BC
WEDPS512K32V-12BC CAD Models
WEDPS512K32V-12BC Part Data Attributes
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WEDPS512K32V-12BC
White Electronic Designs Corp
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Datasheet
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WEDPS512K32V-12BC
White Electronic Designs Corp
SRAM Module, 512KX32, 12ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | WHITE ELECTRONIC DESIGNS CORP | |
| Package Description | 16 X 18 MM, PLASTIC, BGA-143 | |
| Reach Compliance Code | unknown | |
| Access Time-Max | 12 ns | |
| Additional Feature | ALSO CONFIGURABLE AS 2M X 8 | |
| Alternate Memory Width | 16 | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B143 | |
| Length | 18 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | SRAM MODULE | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Terminals | 143 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 512KX32 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA143,12X12,50 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.21 mm | |
| Standby Current-Max | 0.12 A | |
| Standby Voltage-Min | 3 V | |
| Supply Current-Max | 0.4 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 16 mm |