Part Details for WEDPN4M72V-125B2M by Microsemi Corporation
Overview of WEDPN4M72V-125B2M by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for WEDPN4M72V-125B2M
WEDPN4M72V-125B2M CAD Models
WEDPN4M72V-125B2M Part Data Attributes
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WEDPN4M72V-125B2M
Microsemi Corporation
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Datasheet
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WEDPN4M72V-125B2M
Microsemi Corporation
Synchronous DRAM, 4MX72, 6ns, CMOS, PBGA219, 21 X 21 MM, PLASTIC, BGA-219
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICROSEMI CORP | |
Part Package Code | BGA | |
Package Description | BGA, BGA219,16X16,50 | |
Pin Count | 219 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.28 | |
Access Mode | FOUR BANK PAGE BURST | |
Access Time-Max | 6 ns | |
Additional Feature | AUTO/SELF REFRESH | |
Clock Frequency-Max (fCLK) | 125 MHz | |
I/O Type | COMMON | |
JESD-30 Code | S-PBGA-B219 | |
Memory Density | 301989888 bit | |
Memory IC Type | SYNCHRONOUS DRAM | |
Memory Width | 72 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 219 | |
Number of Words | 4194304 words | |
Number of Words Code | 4000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 4MX72 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA219,16X16,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Refresh Cycles | 4096 | |
Self Refresh | YES | |
Standby Current-Max | 0.225 A | |
Supply Current-Max | 0.7 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Alternate Parts for WEDPN4M72V-125B2M
This table gives cross-reference parts and alternative options found for WEDPN4M72V-125B2M. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WEDPN4M72V-125B2M, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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WEDPN4M72V-125BI | Synchronous DRAM Module, 4MX72, 6ns, CMOS, PBGA219, 25 X 21 MM, PLASTIC, BGA-219 | White Electronic Designs Corp | WEDPN4M72V-125B2M vs WEDPN4M72V-125BI |
WEDPN4M72V-125BC | Synchronous DRAM Module, 4MX72, 6ns, CMOS, PBGA219, 25 X 21 MM, PLASTIC, BGA-219 | White Electronic Designs Corp | WEDPN4M72V-125B2M vs WEDPN4M72V-125BC |