Part Details for WED9LC6816V1310BI by White Microelectronics
Overview of WED9LC6816V1310BI by White Microelectronics
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Part Details for WED9LC6816V1310BI
WED9LC6816V1310BI CAD Models
WED9LC6816V1310BI Part Data Attributes
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WED9LC6816V1310BI
White Microelectronics
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Datasheet
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WED9LC6816V1310BI
White Microelectronics
Memory Circuit, 4MX32, CMOS, PBGA153, MO-163, BGA-153
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | WHITE MICROELECTRONICS | |
| Package Description | MO-163, BGA-153 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Additional Feature | 256K X 32-BIT SRAM ALSO AVAILABLE | |
| JESD-30 Code | R-PBGA-B153 | |
| Memory Density | 134217728 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Terminals | 153 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 4MX32 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3.135 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM |