There are no models available for this part yet.
Overview of WED2ZL361MS38BC by White Electronic Designs Corp
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Smart Cities
CAD Models for WED2ZL361MS38BC by White Electronic Designs Corp
Part Data Attributes for WED2ZL361MS38BC by White Electronic Designs Corp
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
WHITE ELECTRONIC DESIGNS CORP
|
Package Description
|
PLASTIC, BGA-119
|
Reach Compliance Code
|
unknown
|
Access Time-Max
|
3.8 ns
|
Additional Feature
|
PIPELINED ARCHITECTURE
|
JESD-30 Code
|
R-PBGA-B119
|
Length
|
23 mm
|
Memory Density
|
37748736 bit
|
Memory IC Type
|
ZBT SRAM
|
Memory Width
|
36
|
Number of Functions
|
1
|
Number of Terminals
|
119
|
Number of Words
|
1048576 words
|
Number of Words Code
|
1000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
1MX36
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY
|
Parallel/Serial
|
PARALLEL
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
2.794 mm
|
Supply Voltage-Max (Vsup)
|
2.625 V
|
Supply Voltage-Min (Vsup)
|
2.375 V
|
Supply Voltage-Nom (Vsup)
|
2.5 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1.27 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Width
|
17 mm
|
Alternate Parts for WED2ZL361MS38BC
This table gives cross-reference parts and alternative options found for WED2ZL361MS38BC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of WED2ZL361MS38BC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
GS832436B-150 | Cache SRAM, 1MX36, 10ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119 | GSI Technology | WED2ZL361MS38BC vs GS832436B-150 |
GS832436GB-225T | Cache SRAM, 1MX36, 6ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119 | GSI Technology | WED2ZL361MS38BC vs GS832436GB-225T |
GS8322Z36GB-150T | ZBT SRAM, 1MX36, 8.5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, FPBGA-119 | GSI Technology | WED2ZL361MS38BC vs GS8322Z36GB-150T |
GS8324Z36B-250IT | ZBT SRAM, 1MX36, 6ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119 | GSI Technology | WED2ZL361MS38BC vs GS8324Z36B-250IT |
K7N323645M-HC160 | ZBT SRAM, 1MX36, 3.5ns, CMOS, PBGA119, BGA-119 | Samsung Semiconductor | WED2ZL361MS38BC vs K7N323645M-HC160 |
GS8322Z36AGB-333IV | ZBT SRAM, 1MX36, 5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, FPBGA-119 | GSI Technology | WED2ZL361MS38BC vs GS8322Z36AGB-333IV |
K7P323666M-HC250 | Late-Write SRAM, 1MX36, 2ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119 | Samsung Semiconductor | WED2ZL361MS38BC vs K7P323666M-HC250 |
GS832236AB-300 | Cache SRAM, 1MX36, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, FPBGA-119 | GSI Technology | WED2ZL361MS38BC vs GS832236AB-300 |
GS8322ZV36B-133 | ZBT SRAM, 1MX36, 8.5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 PITCH, FPBGA-119 | GSI Technology | WED2ZL361MS38BC vs GS8322ZV36B-133 |
GS832436GB-150T | Cache SRAM, 1MX36, 10ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119 | GSI Technology | WED2ZL361MS38BC vs GS832436GB-150T |