Datasheets
WE256K8200CMA by:

EEPROM Module, 256KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, DUAL CAVITY, BOTTOM BRAZED, CERAMIC, DIP-32

Part Details for WE256K8200CMA by White Electronic Designs Corp

Overview of WE256K8200CMA by White Electronic Designs Corp

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Part Details for WE256K8200CMA

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WE256K8200CMA Part Data Attributes

WE256K8200CMA White Electronic Designs Corp
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WE256K8200CMA White Electronic Designs Corp EEPROM Module, 256KX8, 200ns, Parallel, CMOS, CDIP32, HERMETIC SEALED, DUAL CAVITY, BOTTOM BRAZED, CERAMIC, DIP-32
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer WHITE ELECTRONIC DESIGNS CORP
Package Description HERMETIC SEALED, DUAL CAVITY, BOTTOM BRAZED, CERAMIC, DIP-32
Reach Compliance Code unknown
Access Time-Max 200 ns
JESD-30 Code R-CDIP-T32
JESD-609 Code e0
Length 40.6 mm
Memory Density 2097152 bit
Memory IC Type EEPROM MODULE
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 262144 words
Number of Words Code 256000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 256KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Programming Voltage 5 V
Qualification Status Not Qualified
Seated Height-Max 5.1 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm
Write Cycle Time-Max (tWC) 10 ms

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