Datasheets
W979H6KBVX1E by: Winbond Electronics Corp

DDR DRAM, 32MX16, CMOS, PBGA134, VFBGA-134

Part Details for W979H6KBVX1E by Winbond Electronics Corp

Results Overview of W979H6KBVX1E by Winbond Electronics Corp

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Applications Space Technology Aerospace and Defense Transportation and Logistics Renewable Energy Automotive Robotics and Drones

W979H6KBVX1E Information

W979H6KBVX1E by Winbond Electronics Corp is a DRAM.
DRAMs are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for W979H6KBVX1E

Part # Distributor Description Stock Price Buy
DISTI # 256-W979H6KBVX1E-ND
DigiKey IC DRAM 512MBIT HSUL 12 134VFBGA Min Qty: 168 Lead time: 16 Weeks Container: Tray Limited Supply - Call
  • 168 $3.8439
$3.8439 Buy Now
DISTI # 454-W979H6KBVX1E
Mouser Electronics DRAM 512Mb LPDDR2, x16, 533MHz RoHS: Compliant 0
  • 1 $4.9100
  • 10 $4.4600
  • 100 $3.8900
  • 168 $3.8800
  • 504 $3.7300
  • 1,008 $3.5500
$3.5500 / $4.9100 Order Now
NAC 512Mb LPDDR2, x16, 533MHz, VFBGA 134 Package RoHS: Compliant Min Qty: 168 Package Multiple: 168 0
  • 168 $3.6000
  • 840 $3.1200
$3.1200 / $3.6000 Buy Now

Part Details for W979H6KBVX1E

W979H6KBVX1E CAD Models

W979H6KBVX1E Part Data Attributes

W979H6KBVX1E Winbond Electronics Corp
Buy Now Datasheet
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W979H6KBVX1E Winbond Electronics Corp DDR DRAM, 32MX16, CMOS, PBGA134, VFBGA-134
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Rohs Code Yes
Part Life Cycle Code Not Recommended
Ihs Manufacturer WINBOND ELECTRONICS CORP
Package Description VFBGA,
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.28
Samacsys Manufacturer Winbond
Access Mode FOUR BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
JESD-30 Code R-PBGA-B134
Length 11.5 mm
Memory Density 536870912 bit
Memory IC Type LPDDR2 DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 134
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode SYNCHRONOUS
Organization 32MX16
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1 mm
Self Refresh YES
Supply Voltage-Max (Vsup) 1.3 V
Supply Voltage-Min (Vsup) 1.14 V
Supply Voltage-Nom (Vsup) 1.2 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 0.65 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10 mm

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