Part Details for W78E858-40 by Winbond Electronics Corp
Overview of W78E858-40 by Winbond Electronics Corp
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- Part Data Attributes: (Available)
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Applications
Industrial Automation
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
Part Details for W78E858-40
W78E858-40 CAD Models
W78E858-40 Part Data Attributes:
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W78E858-40
Winbond Electronics Corp
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W78E858-40
Winbond Electronics Corp
Microcontroller, 8-Bit, FLASH, 8051 CPU, 20MHz, CMOS, PDIP40,
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Package Description | DIP, DIP40,.6 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Bit Size | 8 | |
| CPU Family | 8051 | |
| JESD-30 Code | R-PDIP-T40 | |
| Number of Terminals | 40 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP40,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 768 | |
| ROM (words) | 32768 | |
| ROM Programmability | FLASH | |
| Speed | 20 MHz | |
| Supply Current-Max | 20 mA | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |