Part Details for W66CQ2NQUAGJ by Winbond Electronics Corp
Overview of W66CQ2NQUAGJ by Winbond Electronics Corp
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Space Technology
Aerospace and Defense
Energy and Power Systems
Price & Stock for W66CQ2NQUAGJ
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
256-W66CQ2NQUAGJ-ND
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DigiKey | IC DRAM 4GBIT LVSTL 11 200WFBGA Min Qty: 144 Lead time: 24 Weeks Container: Tray | Temporarily Out of Stock |
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$5.1704 | Buy Now |
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DISTI #
454-W66CQ2NQUAGJ
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Mouser Electronics | DRAM 4Gb LPDDR4X, DDP, x32, 1866MHz, -40C-105C RoHS: Compliant | 0 |
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$4.6500 / $6.5100 | Order Now |
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NAC | 4Gb LPDDR4X, DDP, x32, 1866MHz, -40C~105C, WFBGA200 Package RoHS: Compliant Min Qty: 144 Package Multiple: 144 | 0 |
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$4.2900 / $4.6000 | Buy Now |
Part Details for W66CQ2NQUAGJ
W66CQ2NQUAGJ CAD Models
W66CQ2NQUAGJ Part Data Attributes
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W66CQ2NQUAGJ
Winbond Electronics Corp
Buy Now
Datasheet
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W66CQ2NQUAGJ
Winbond Electronics Corp
DRAM,
|
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Package Description | , | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Date Of Intro | 2020-06-24 | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY;TERM PITCH-MAX | |
| Clock Frequency-Max (fCLK) | 1869.1 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 16,32 | |
| JESD-30 Code | R-PBGA-B200 | |
| Length | 14.5 mm | |
| Memory Density | 4294967296 bit | |
| Memory IC Type | LPDDR4X DRAM | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 200 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128MX32 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA200,12X22,32/25 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Seated Height-Max | 0.8 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 16,32 | |
| Supply Voltage-Max (Vsup) | 1.17 V | |
| Supply Voltage-Min (Vsup) | 1.06 V | |
| Supply Voltage-Nom (Vsup) | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 10 mm |