Part Details for W66CL2NQUAFI by Winbond Electronics Corp
Overview of W66CL2NQUAFI by Winbond Electronics Corp
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Telecommunications
Price & Stock for W66CL2NQUAFI
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
454-W66CL2NQUAFI
|
Mouser Electronics | DRAM 4Gb LPDDR4, DDP, x32, 1600MHz, Industrial Temp | 0 |
|
$7.3600 / $8.1000 | Order Now |
|
|
NAC | 4Gb LPDDR4, DDP, x32, 1600MHz, Industrial Temp, WFBGA200 Package RoHS: Compliant Min Qty: 144 Package Multiple: 144 | 0 |
|
$7.9600 / $8.3800 | Buy Now |
|
DISTI #
C1S810600032976
|
Chip1Stop | 4G mDDR4, DDP, x32, 1600MHz, Industrial Temp Container: Tray | 80 |
|
$5.8100 / $6.0600 | Buy Now |
Part Details for W66CL2NQUAFI
W66CL2NQUAFI CAD Models
W66CL2NQUAFI Part Data Attributes:
|
|
W66CL2NQUAFI
Winbond Electronics Corp
Buy Now
Datasheet
|
Compare Parts:
W66CL2NQUAFI
Winbond Electronics Corp
DDR DRAM,
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Samacsys Manufacturer | Winbond | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | AUTO/SELF REFRESH, IT ALSO REQUIRES 1.8V NOMINAL SUPPLY VOLTAGE | |
| Clock Frequency-Max (fCLK) | 1600 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 16,32 | |
| JESD-30 Code | R-PBGA-B200 | |
| Length | 14.5 mm | |
| Memory Density | 4294967296 bit | |
| Memory IC Type | LPDDR4 DRAM | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 200 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128MX32 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA200,12X20,32/25 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 0.8 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 16,32 | |
| Supply Voltage-Max (Vsup) | 1.17 V | |
| Supply Voltage-Min (Vsup) | 1.06 V | |
| Supply Voltage-Nom (Vsup) | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 10 mm |