Part Details for W632GG8MB-12 by Winbond Electronics Corp
Overview of W632GG8MB-12 by Winbond Electronics Corp
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for W632GG8MB-12
Part # | Distributor | Description | Stock | Price | Buy | |
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NAC | 2Gb DDR3 SDRAM, x8, 800MHz,, WBGA78 Package RoHS: Compliant Min Qty: 242 Package Multiple: 242 | 0 |
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Part Details for W632GG8MB-12
W632GG8MB-12 CAD Models
W632GG8MB-12 Part Data Attributes
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W632GG8MB-12
Winbond Electronics Corp
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Datasheet
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W632GG8MB-12
Winbond Electronics Corp
DDR DRAM, 256MX8, CMOS, PBGA78, VFBGA-78
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
Package Description | VFBGA, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | |
Date Of Intro | 2017-06-14 | |
Access Mode | MULTI BANK PAGE BURST | |
Additional Feature | AUTO/SELF REFRESH | |
JESD-30 Code | R-PBGA-B78 | |
Length | 10.5 mm | |
Memory Density | 2147483648 bit | |
Memory IC Type | DDR DRAM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 78 | |
Number of Words | 268435456 words | |
Number of Words Code | 256000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 256MX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Seated Height-Max | 1 mm | |
Self Refresh | YES | |
Supply Voltage-Max (Vsup) | 1.575 V | |
Supply Voltage-Min (Vsup) | 1.425 V | |
Supply Voltage-Nom (Vsup) | 1.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 8 mm |