Part Details for W631GU6KB12K by Winbond Electronics Corp
Overview of W631GU6KB12K by Winbond Electronics Corp
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (4 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for W631GU6KB12K
| Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | DDR3L DRAM, 64MX16, 0.225NS, CMOS, PBGA96 | 198 |
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$3.0000 / $7.5000 | Buy Now |
Part Details for W631GU6KB12K
W631GU6KB12K CAD Models
W631GU6KB12K Part Data Attributes:
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W631GU6KB12K
Winbond Electronics Corp
Buy Now
Datasheet
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Compare Parts:
W631GU6KB12K
Winbond Electronics Corp
DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, 9 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-96
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Part Package Code | BGA | |
| Package Description | TFBGA, BGA96,9X16,32 | |
| Pin Count | 96 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.32 | |
| Access Mode | MULTI BANK PAGE BURST | |
| Access Time-Max | 0.225 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 800 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 8 | |
| JESD-30 Code | R-PBGA-B96 | |
| Length | 13 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | DDR3L DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 96 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA96,9X16,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 8 | |
| Standby Current-Max | 0.014 A | |
| Supply Current-Max | 0.4 mA | |
| Supply Voltage-Max (Vsup) | 1.45 V | |
| Supply Voltage-Min (Vsup) | 1.283 V | |
| Supply Voltage-Nom (Vsup) | 1.35 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 9 mm |
Alternate Parts for W631GU6KB12K
This table gives cross-reference parts and alternative options found for W631GU6KB12K. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W631GU6KB12K, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| W631GU6KB-12 | DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, WBGA-96 | Winbond Electronics Corp | W631GU6KB12K vs W631GU6KB-12 |
| W631GU6MB12J | DDR DRAM, | Winbond Electronics Corp | W631GU6KB12K vs W631GU6MB12J |
| W631GU6KB12A | DDR DRAM, 64MX16, 0.225ns, CMOS, PBGA96, 9 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-96 | Winbond Electronics Corp | W631GU6KB12K vs W631GU6KB12A |
| W631GU6MB-12 | DDR DRAM, | Winbond Electronics Corp | W631GU6KB12K vs W631GU6MB-12 |