Datasheets
W631GG8MB11J by: Winbond Electronics Corp

DDR DRAM,

Part Details for W631GG8MB11J by Winbond Electronics Corp

Overview of W631GG8MB11J by Winbond Electronics Corp

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Automotive Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Part Details for W631GG8MB11J

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W631GG8MB11J Part Data Attributes

W631GG8MB11J Winbond Electronics Corp
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W631GG8MB11J Winbond Electronics Corp DDR DRAM,
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP
Package Description VFBGA-78
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.32
Date Of Intro 2017-12-01
Access Mode MULTI BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B78
Length 10.5 mm
Memory Density 1073741824 bit
Memory IC Type DDR DRAM
Memory Width 8
Number of Functions 1
Number of Ports 1
Number of Terminals 78
Number of Words 134217728 words
Number of Words Code 128000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Organization 128MX8
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Seated Height-Max 1 mm
Self Refresh YES
Supply Voltage-Max (Vsup) 1.575 V
Supply Voltage-Min (Vsup) 1.425 V
Supply Voltage-Nom (Vsup) 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 8 mm

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