Datasheets
W631GG6NB-15 by: Winbond Electronics Corp

DDR3 DRAM, 64MX16, 20ns, CMOS, PBGA96,

Part Details for W631GG6NB-15 by Winbond Electronics Corp

Overview of W631GG6NB-15 by Winbond Electronics Corp

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Price & Stock for W631GG6NB-15

Part # Distributor Description Stock Price Buy
DISTI # 256-W631GG6NB-15-ND
DigiKey IC DRAM 1GBIT SSTL 15 96VFBGA Min Qty: 1 Lead time: 12 Weeks Container: Tray 4676
In Stock
  • 1 $2.3700
  • 10 $2.1460
  • 25 $2.0992
  • 40 $2.0880
  • 198 $2.0000
$2.0000 / $2.3700 Buy Now
DISTI # 454-W631GG6NB-15
Mouser Electronics DRAM 1Gb DDR3 SDRAM, x16, 667MHz RoHS: Compliant 0
  • 1 $2.3700
  • 10 $2.0900
  • 198 $2.0000
$2.0000 / $2.3700 Order Now
NAC 1Gb DDR3 SDRAM, x16, 667MHz, WBGA96 Package RoHS: Compliant Min Qty: 198 Package Multiple: 198 0
  • 198 $3.7400
  • 990 $3.5500
$3.5500 / $3.7400 Buy Now

Part Details for W631GG6NB-15

W631GG6NB-15 Part Data Attributes

W631GG6NB-15 Winbond Electronics Corp
Buy Now Datasheet
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W631GG6NB-15 Winbond Electronics Corp DDR3 DRAM, 64MX16, 20ns, CMOS, PBGA96,
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer WINBOND ELECTRONICS CORP
Reach Compliance Code compliant
Samacsys Manufacturer Winbond
Access Mode MULTI BANK PAGE BURST
Access Time-Max 20 ns
Clock Frequency-Max (fCLK) 667 MHz
I/O Type COMMON
Interleaved Burst Length 8
JESD-30 Code R-PBGA-B96
Length 13 mm
Memory Density 1073741824 bit
Memory IC Type DDR3 DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 96
Number of Words 67108864 words
Number of Words Code 64000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 95 °C
Operating Temperature-Min
Organization 64MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA96,9X16,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Seated Height-Max 1 mm
Self Refresh YES
Sequential Burst Length 8
Standby Current-Max 0.035 A
Supply Current-Max 0.2 mA
Supply Voltage-Max (Vsup) 1.575 V
Supply Voltage-Min (Vsup) 1.425 V
Supply Voltage-Nom (Vsup) 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 7.5 mm

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