Part Details for W3H64M16E-400B2M by Mercury Systems Inc
Overview of W3H64M16E-400B2M by Mercury Systems Inc
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Applications
Computing and Data Storage
Part Details for W3H64M16E-400B2M
W3H64M16E-400B2M CAD Models
W3H64M16E-400B2M Part Data Attributes
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W3H64M16E-400B2M
Mercury Systems Inc
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Datasheet
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W3H64M16E-400B2M
Mercury Systems Inc
DDR DRAM, 64MX16, 0.8ns, CMOS, PBGA79, BGA-79
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MERCURY SYSTEMS INC | |
| Package Description | BGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.32 | |
| Access Mode | MULTI BANK PAGE BURST | |
| Access Time-Max | 0.8 ns | |
| Additional Feature | AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED | |
| JESD-30 Code | R-PBGA-B79 | |
| JESD-609 Code | e0 | |
| Length | 14.1 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | DDR2 DRAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 79 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 64MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Seated Height-Max | 2.42 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 11.1 mm |