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Part Details for W29N01HVBINA by Winbond Electronics Corp
Overview of W29N01HVBINA by Winbond Electronics Corp
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for W29N01HVBINA
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
W29N01HVBINA-ND
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DigiKey | IC FLASH 1GBIT 63-VFBGA Min Qty: 210 Lead time: 12 Weeks Container: Tray | Temporarily Out of Stock |
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$2.8821 | Buy Now |
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DISTI #
454-W29N01HVBINA
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Mouser Electronics | NAND Flash 1G-bit NAND flash, 3V, 1-bit ECC, 3V, x8 RoHS: Compliant | 0 |
|
$2.7800 / $2.8800 | Order Now |
|
|
NAC | 1G-bit NAND flash, 3V, 1-bit ECC, 3V, x8, VFBGA63 (9x11mm) Package RoHS: Compliant Min Qty: 210 Package Multiple: 210 | 0 |
|
$2.3900 / $2.7500 | Buy Now |
Part Details for W29N01HVBINA
W29N01HVBINA CAD Models
W29N01HVBINA Part Data Attributes
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W29N01HVBINA
Winbond Electronics Corp
Buy Now
Datasheet
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Compare Parts:
W29N01HVBINA
Winbond Electronics Corp
Flash, 128MX8, PBGA63, VFBGA-63
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Package Description | VFBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Samacsys Manufacturer | Winbond | |
| Command User Interface | YES | |
| Data Polling | NO | |
| Data Retention Time-Min | 10 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B63 | |
| JESD-609 Code | e1 | |
| Length | 11 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Sectors/Size | 1K | |
| Number of Terminals | 63 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA63,10X12,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Page Size | 1K words | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 3.3 V | |
| Ready/Busy | YES | |
| Seated Height-Max | 1 mm | |
| Sector Size | 128K | |
| Standby Current-Max | 0.00005 A | |
| Supply Current-Max | 0.035 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Toggle Bit | YES | |
| Type | SLC NAND TYPE | |
| Width | 9 mm | |
| Write Cycle Time-Max (tWC) | 0.025 ms |