Datasheets
W29EE012 by: Winbond Electronics Corp

Flash, 128KX8, 150ns, DIE

Part Details for W29EE012 by Winbond Electronics Corp

Overview of W29EE012 by Winbond Electronics Corp

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Part Details for W29EE012

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W29EE012 Part Data Attributes:

W29EE012 Winbond Electronics Corp
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W29EE012 Winbond Electronics Corp Flash, 128KX8, 150ns, DIE
Part Life Cycle Code Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP
Part Package Code DIE
Package Description DIE
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 150 ns
JESD-30 Code R-XUUC-N
Memory Density 1048576 bit
Memory IC Type FLASH
Memory Width 8
Number of Functions 1
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 128KX8
Package Body Material UNSPECIFIED
Package Code DIE
Package Shape RECTANGULAR
Package Style UNCASED CHIP
Parallel/Serial PARALLEL
Programming Voltage 5 V
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form NO LEAD
Terminal Position UPPER
Type NOR TYPE
Write Cycle Time-Max (tWC) 10 ms

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