Part Details for W27L01T-90 by Winbond Electronics Corp
Overview of W27L01T-90 by Winbond Electronics Corp
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Part Details for W27L01T-90
W27L01T-90 CAD Models
W27L01T-90 Part Data Attributes:
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W27L01T-90
Winbond Electronics Corp
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Datasheet
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W27L01T-90
Winbond Electronics Corp
EEPROM, 128KX8, 90ns, Parallel, CMOS, PDSO32, 8 X 20 MM, TSOP-32
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Part Package Code | TSOP | |
| Package Description | TSOP1, | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 90 ns | |
| JESD-30 Code | R-PDSO-G32 | |
| JESD-609 Code | e0 | |
| Length | 18.4 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 128KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSOP1 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 3.63 V | |
| Supply Voltage-Min (Vsup) | 2.97 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Width | 8 mm |
Alternate Parts for W27L01T-90
This table gives cross-reference parts and alternative options found for W27L01T-90. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W27L01T-90, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY27C64-150JC | OTP ROM, 8KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32 | Rochester Electronics LLC | W27L01T-90 vs CY27C64-150JC |
| MX27C4100MC-90 | OTP ROM, 512KX8, 90ns, CMOS, PDSO40, PLASTIC, SOP-40 | Macronix International Co Ltd | W27L01T-90 vs MX27C4100MC-90 |
| M28W320C-ZBT | 2MX16 FLASH 3V PROM, PBGA47, 6.39 X 10.50 MM, 0.75 MM PITCH, TFBGA-47 | STMicroelectronics | W27L01T-90 vs M28W320C-ZBT |
| CY7C265-15DC | OTP ROM, 8KX8, 12ns, CMOS, CDIP28, 0.300 INCH, SLIM, CERDIP-28 | Cypress Semiconductor | W27L01T-90 vs CY7C265-15DC |
| CY27C64-200PC | OTP ROM, 8KX8, 200ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Rochester Electronics LLC | W27L01T-90 vs CY27C64-200PC |
| IS28LV020-90T | Flash, 256KX8, 90ns, PDSO32, TSOP-32 | Integrated Silicon Solution Inc | W27L01T-90 vs IS28LV020-90T |
| MX27L2000TC-70R | OTP ROM, 256KX8, 70ns, CMOS, PDSO32, 8 X 20 MM, PLASTIC, MO-142, TSOP1-32 | Macronix International Co Ltd | W27L01T-90 vs MX27L2000TC-70R |
| AM29F002T-120EEB | Flash, PDSO32, TSOP-32 | Spansion | W27L01T-90 vs AM29F002T-120EEB |
| 5962-9669204HXC | Flash Module, 512KX8, 70ns, CDMA32, DIP-32 | Cobham Power Products | W27L01T-90 vs 5962-9669204HXC |
| KM28C65AJI-12 | EEPROM, 8KX8, Parallel, CMOS, PQCC32, PLASTIC, LCC-32 | Samsung Semiconductor | W27L01T-90 vs KM28C65AJI-12 |