Part Details for W27L010P-12 by Winbond Electronics Corp
Overview of W27L010P-12 by Winbond Electronics Corp
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Part Details for W27L010P-12
W27L010P-12 CAD Models
W27L010P-12 Part Data Attributes:
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W27L010P-12
Winbond Electronics Corp
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Datasheet
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W27L010P-12
Winbond Electronics Corp
EEPROM, 128KX8, 120ns, Parallel, CMOS, PQCC32, PLASTIC, LCC-32
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Part Package Code | QFJ | |
| Package Description | QCCJ, LDCC32,.5X.6 | |
| Pin Count | 32 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 120 ns | |
| Additional Feature | TTL/CMOS COMPATIBLE INPUT & OUTPUT | |
| Command User Interface | NO | |
| Data Polling | NO | |
| JESD-30 Code | R-PQCC-J32 | |
| JESD-609 Code | e0 | |
| Length | 13.97 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 128KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QCCJ | |
| Package Equivalence Code | LDCC32,.5X.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.56 mm | |
| Standby Current-Max | 0.00002 A | |
| Supply Current-Max | 0.01 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | J BEND | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Toggle Bit | NO | |
| Width | 11.43 mm |
Alternate Parts for W27L010P-12
This table gives cross-reference parts and alternative options found for W27L010P-12. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W27L010P-12, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27C64-150DCB | UVPROM, 8KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | Rochester Electronics LLC | W27L010P-12 vs AM27C64-150DCB |
| CY7C265-15DC | OTP ROM, 8KX8, 12ns, CMOS, CDIP28, 0.300 INCH, SLIM, CERDIP-28 | Cypress Semiconductor | W27L010P-12 vs CY7C265-15DC |
| CY27C64-200PC | OTP ROM, 8KX8, 200ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 | Rochester Electronics LLC | W27L010P-12 vs CY27C64-200PC |
| M28W320C-ZBT | 2MX16 FLASH 3V PROM, PBGA47, 6.39 X 10.50 MM, 0.75 MM PITCH, TFBGA-47 | STMicroelectronics | W27L010P-12 vs M28W320C-ZBT |
| HY27UH08AG5BTC | Flash, 2GX8, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48 | SK Hynix Inc | W27L010P-12 vs HY27UH08AG5BTC |
| M28256-20WKA1 | 32KX8 EEPROM 3V, 200ns, PQCC32, PLASTIC, LCC-32 | STMicroelectronics | W27L010P-12 vs M28256-20WKA1 |
| CY7C265-15LC | OTP ROM, 8KX8, 12ns, CMOS, CQCC28, LCC-28 | Cypress Semiconductor | W27L010P-12 vs CY7C265-15LC |
| AM28F010-200C3LI | Flash | Rochester Electronics LLC | W27L010P-12 vs AM28F010-200C3LI |
| M27C4001-70XB6 | 512KX8 OTPROM, 70ns, PDIP32, 0.600 INCH, LEAD FREE, PLASTIC, DIP-32 | STMicroelectronics | W27L010P-12 vs M27C4001-70XB6 |
| AM28F010-150DI | Flash, 128KX8, 150ns, CDIP32, HERMETIC SEALED, CERAMIC, DIP-32 | Rochester Electronics LLC | W27L010P-12 vs AM28F010-150DI |