Part Details for W27C01Q-70 by Winbond Electronics Corp
Overview of W27C01Q-70 by Winbond Electronics Corp
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Internet of Things (IoT)
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Part Details for W27C01Q-70
W27C01Q-70 CAD Models
W27C01Q-70 Part Data Attributes
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W27C01Q-70
Winbond Electronics Corp
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W27C01Q-70
Winbond Electronics Corp
EEPROM, 128KX8, 70ns, Parallel, CMOS, PDSO32, 8 X 14 MM, STSOP-32
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
Part Package Code | TSOP | |
Package Description | TSSOP, TSSOP32,.56,20 | |
Pin Count | 32 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.B.1.B.2 | |
HTS Code | 8542.32.00.51 | |
Access Time-Max | 70 ns | |
Command User Interface | NO | |
Data Polling | NO | |
JESD-30 Code | R-PDSO-G32 | |
JESD-609 Code | e0 | |
Length | 12.4 mm | |
Memory Density | 1048576 bit | |
Memory IC Type | EEPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 131072 words | |
Number of Words Code | 128000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 128KX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP32,.56,20 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 5 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.03 mA | |
Supply Voltage-Max (Vsup) | 5.25 V | |
Supply Voltage-Min (Vsup) | 4.75 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | DUAL | |
Toggle Bit | NO | |
Width | 8 mm |