Part Details for W25Q64CVSSBG by Winbond Electronics Corp
Overview of W25Q64CVSSBG by Winbond Electronics Corp
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- Part Data Attributes: (Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for W25Q64CVSSBG
W25Q64CVSSBG CAD Models
W25Q64CVSSBG Part Data Attributes
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W25Q64CVSSBG
Winbond Electronics Corp
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Datasheet
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W25Q64CVSSBG
Winbond Electronics Corp
Flash, 8MX8, PDSO8, SOIC-8
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
Package Description | SOIC-8 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Clock Frequency-Max (fCLK) | 80 MHz | |
JESD-30 Code | S-PDSO-G8 | |
Length | 5.23 mm | |
Memory Density | 67108864 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Number of Words | 8388608 words | |
Number of Words Code | 8000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 8MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Shape | SQUARE | |
Package Style | SMALL OUTLINE | |
Parallel/Serial | SERIAL | |
Programming Voltage | 3 V | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 2.16 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Width | 5.23 mm |