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Part Details for W25N01GVTBIT by Winbond Electronics Corp
Overview of W25N01GVTBIT by Winbond Electronics Corp
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for W25N01GVTBIT
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
256-W25N01GVTBIT-ND
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DigiKey | IC FLASH 1GBIT SPI/QUAD 24TFBGA Lead time: 28 Weeks Container: Tray | Temporarily Out of Stock |
|
Buy Now | |
|
DISTI #
454-W25N01GVTBIT
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Mouser Electronics | NAND Flash 1G-bit Serial NAND flash, 3V RoHS: Compliant | 0 |
|
Order Now | |
|
DISTI #
V99:2348_15944021
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Arrow Electronics | SLC NAND Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 1G-bit 128M x 8 7ns 24-Pin TFBGA Tray RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 28 Weeks Date Code: 1834 | Americas - 114 |
|
$0.2912 / $1.5306 | Buy Now |
|
DISTI #
30717468
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Verical | SLC NAND Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 1G-bit 128M x 8 7ns 24-Pin TFBGA Tray RoHS: Compliant Min Qty: 4 Package Multiple: 1 Date Code: 1834 | Americas - 114 |
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$1.5306 | Buy Now |
|
|
NAC | 1G-bit Serial NAND flash, 3V, TFBGA24 (8x6mm, 5x5-1 Ball Array) Package RoHS: Compliant Package Multiple: 1 | 0 |
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RFQ |
Part Details for W25N01GVTBIT
W25N01GVTBIT CAD Models
W25N01GVTBIT Part Data Attributes
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W25N01GVTBIT
Winbond Electronics Corp
Buy Now
Datasheet
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W25N01GVTBIT
Winbond Electronics Corp
Flash, 1GX1, PBGA24, TFBGA-24
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | WINBOND ELECTRONICS CORP | |
| Package Description | TFBGA-24 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Samacsys Manufacturer | Winbond | |
| Clock Frequency-Max (fCLK) | 104 MHz | |
| Data Retention Time-Min | 10 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 8 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA24,5X5,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 3 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Serial Bus Type | QSPI | |
| Standby Current-Max | 0.00005 A | |
| Supply Current-Max | 0.035 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Type | SLC NAND TYPE | |
| Width | 6 mm | |
| Write Protection | HARDWARE/SOFTWARE |