Part Details for UT16MX113-XPC by Cobham Semiconductor Solutions
Overview of UT16MX113-XPC by Cobham Semiconductor Solutions
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Applications
Space Technology
Environmental Monitoring
Internet of Things (IoT)
Smart Cities
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Consumer Electronics
Education and Research
Security and Surveillance
Aerospace and Defense
Healthcare
Robotics and Drones
Part Details for UT16MX113-XPC
UT16MX113-XPC CAD Models
UT16MX113-XPC Part Data Attributes
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UT16MX113-XPC
Cobham Semiconductor Solutions
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Datasheet
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UT16MX113-XPC
Cobham Semiconductor Solutions
Single-Ended Multiplexer, 1 Func, 16 Channel, CDFP28, CERAMIC, FLATPACK-28
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | AEROFLEX COLORADO SPRINGS | |
| Part Package Code | DFP | |
| Package Description | HDFP, | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Analog IC - Other Type | SINGLE-ENDED MULTIPLEXER | |
| JESD-30 Code | R-CDFP-F28 | |
| Length | 18.11 mm | |
| Number of Channels | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Off-state Isolation-Nom | 80 dB | |
| On-state Resistance-Max (Ron) | 300 Ω | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HDFP | |
| Package Equivalence Code | FL28,.5 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK, HEAT SINK/SLUG | |
| Screening Level | MIL-STD-883 | |
| Seated Height-Max | 3.2 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Temperature Grade | MILITARY | |
| Terminal Form | FLAT | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Width | 13.08 mm |