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UNIVERSAL SERIAL BUS CONTROLLER
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
USB5533B-5000JZX by Microchip Technology Inc is a Bus Controller.
Bus Controllers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
70W1063
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Newark | Usb Hub Controller, 5Gbps, Qfn-64, Usb Ic Type:Usb Hub Controller, Usb Standard:Usb 3.0, Supply V... more RoHS: Compliant Min Qty: 260 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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Buy Now | |
DISTI #
70470336
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RS | USB5533B-5000JZX, USB Controller,5Gbit/s, USB 2.0,USB 3.0,1.25V,3.3V,64-Pin QFN Min Qty: 260 Package Multiple: 1 Lead time: 10 Weeks, 0 Days Container: Bulk | 0 |
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$8.8500 / $10.4100 | RFQ |
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NAC | 3-Port Super Speed USB Hub Controller - Package: 64 QFN 9x9x0.9mm TRAY RoHS: Compliant Min Qty: 1 Package Multiple: 260 Container: Tray | 0 |
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RFQ | |
DISTI #
USB5533B-5000JZX
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Avnet Silica | USB Hub Controller 64Pin QFN (Alt: USB5533B-5000JZX) RoHS: Compliant Min Qty: 260 Package Multiple: 260 | Silica - 0 |
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Buy Now | |
DISTI #
USB5533B-5000JZX
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EBV Elektronik | USB Hub Controller 64Pin QFN (Alt: USB5533B-5000JZX) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 143 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
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USB5533B-5000JZX
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
USB5533B-5000JZX
Microchip Technology Inc
UNIVERSAL SERIAL BUS CONTROLLER
Select a part to compare: |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Package Description | 9 X 9 MM, ROHS COMPLIANT, QFN-64 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | Microchip | |
Additional Feature | ALSO OPERATES AT 3.3 V SUPPLY | |
Address Bus Width | ||
Bus Compatibility | I2C; SMBUS; SPI; USB | |
Clock Frequency-Max | 25 MHz | |
Data Transfer Rate-Max | 625 MBps | |
External Data Bus Width | ||
JESD-30 Code | S-PQCC-N64 | |
JESD-609 Code | e3 | |
Length | 9 mm | |
Number of Terminals | 64 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVQCCN | |
Package Equivalence Code | LCC64,.35SQ,20 | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Screening Level | TS 16949 | |
Seated Height-Max | 1 mm | |
Supply Current-Max | 1029 mA | |
Supply Voltage-Max | 1.31 V | |
Supply Voltage-Min | 1.22 V | |
Supply Voltage-Nom | 1.25 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Width | 9 mm | |
uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, UNIVERSAL SERIAL BUS |
This table gives cross-reference parts and alternative options found for USB5533B-5000JZX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of USB5533B-5000JZX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-speed signals away from the power planes and use a 50-ohm impedance-controlled trace for the USB signals.
Follow the USB-IF guidelines and use the USB 3.2 Gen 2 compliance testing tool to ensure your design meets the specifications. Also, ensure that the device is properly calibrated and configured for optimal performance.
The device has a maximum junction temperature of 125°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. Avoid blocking the airflow around the device.
Use a high-quality voltage regulator that can provide a stable 3.3V supply. Ensure that the power supply can handle the maximum current requirements of the device. Consider using a power management IC (PMIC) for efficient power management.
The device has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use ESD-safe materials and equipment, and ensure that the device is properly grounded during handling.