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576M-BIT Low Latency DRAM Common I/O, TFBGA, /Tray
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
UPD48576236F1-E24-DW1-A | Renesas Electronics Corporation | 576M-BIT Low Latency DRAM Common I/O | |
UPD48576236F1-E18-DW1-A | Renesas Electronics Corporation | 576M-BIT Low Latency DRAM Common I/O |
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
UPD48576236F1-E24-
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Avnet Americas | DRAM Chip DDR2 SDRAM 576Mbit 16M X 36 1.8V 144-Pin PTFBGA Tray - Trays (Alt: UPD48576236F1-E24-) RoHS: Compliant Min Qty: 5 Package Multiple: 1 Lead time: 4 Weeks, 0 Days Container: Tray | 521 Partner Stock |
|
$61.8200 / $76.3700 | Buy Now |
|
Rochester Electronics | UPD48576236F1-E24-DW1-A - 576M-BIT Low Latency DRAM Common I/O ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 521 |
|
$64.9100 / $76.3700 | Buy Now |
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UPD48576236F1-E24-DW1-A
Renesas Electronics Corporation
Buy Now
Datasheet
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UPD48576236F1-E24-DW1-A
Renesas Electronics Corporation
576M-BIT Low Latency DRAM Common I/O, TFBGA, /Tray
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | TFBGA | |
Package Description | TBGA, | |
Pin Count | 144 | |
Manufacturer Package Code | PTBG0144GC-A144 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002 | |
HTS Code | 8542.32.00.32 | |
Factory Lead Time | 4 Weeks | |
Samacsys Manufacturer | Renesas Electronics | |
Access Mode | MULTI BANK PAGE BURST | |
Additional Feature | AUTO REFRESH, TERM PITCH-MAX | |
Clock Frequency-Max (fCLK) | 400 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 2,4,8 | |
JESD-30 Code | R-PBGA-B144 | |
JESD-609 Code | e6 | |
Length | 18.5 mm | |
Memory Density | 603979776 bit | |
Memory IC Type | SYNCHRONOUS DRAM | |
Memory Width | 36 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 144 | |
Number of Words | 16777216 words | |
Number of Words Code | 16000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 95 °C | |
Operating Temperature-Min | ||
Organization | 16MX36 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TBGA | |
Package Equivalence Code | BGA144,12X18,40/32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE | |
Parallel/Serial | PARALLEL | |
Seated Height-Max | 1.2 mm | |
Self Refresh | NO | |
Sequential Burst Length | 2,4,8 | |
Standby Current-Max | 0.215 A | |
Supply Current-Max | 0.409 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN BISMUTH | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 11 mm |