Part Details for UPD17071GB-012-1A7 by NEC Electronics Group
Overview of UPD17071GB-012-1A7 by NEC Electronics Group
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for UPD17071GB-012-1A7
UPD17071GB-012-1A7 CAD Models
UPD17071GB-012-1A7 Part Data Attributes
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UPD17071GB-012-1A7
NEC Electronics Group
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UPD17071GB-012-1A7
NEC Electronics Group
Microcontroller, 4-Bit, CMOS, PQFP56, 10 X 10 MM, 0.65 MM PITCH, PLASTIC, QFP-56
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NEC ELECTRONICS CORP | |
Part Package Code | QFP | |
Package Description | 10 X 10 MM, 0.65 MM PITCH, PLASTIC, QFP-56 | |
Pin Count | 56 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 4 | |
Clock Frequency-Max | 0.075 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | S-PQFP-G56 | |
JESD-609 Code | e0 | |
Length | 10 mm | |
Number of I/O Lines | 21 | |
Number of Terminals | 56 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | -20 °C | |
PWM Channels | NO | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QFP | |
Package Shape | SQUARE | |
Package Style | FLATPACK | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2 mm | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 1.8 V | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | QUAD | |
Width | 10 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |