Datasheets
UL62H1708BSK35G1 by:

Standard SRAM, 128KX8, 35ns, CMOS, PDSO32, 0.450 INCH, LEAD FREE, SOP-32

Part Details for UL62H1708BSK35G1 by ZMDI

Overview of UL62H1708BSK35G1 by ZMDI

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Applications Consumer Electronics Industrial Automation Energy and Power Systems Renewable Energy

Part Details for UL62H1708BSK35G1

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UL62H1708BSK35G1 Part Data Attributes

UL62H1708BSK35G1 ZMDI
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UL62H1708BSK35G1 ZMDI Standard SRAM, 128KX8, 35ns, CMOS, PDSO32, 0.450 INCH, LEAD FREE, SOP-32
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer ZENTRUM MIKROELEKTRONIK DRESDEN AG
Part Package Code SOIC
Package Description SOP,
Pin Count 32
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 35 ns
JESD-30 Code R-PDSO-G32
JESD-609 Code e3
Length 20.445 mm
Memory Density 1048576 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 32
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 128KX8
Package Body Material PLASTIC/EPOXY
Package Code SOP
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified
Seated Height-Max 3 mm
Supply Voltage-Max (Vsup) 2.7 V
Supply Voltage-Min (Vsup) 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 11.3 mm

Alternate Parts for UL62H1708BSK35G1

This table gives cross-reference parts and alternative options found for UL62H1708BSK35G1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of UL62H1708BSK35G1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
UL62H1708BSK35 128KX8 STANDARD SRAM, 35ns, PDSO32, 0.450 INCH, SOP-32 Cypress Semiconductor UL62H1708BSK35G1 vs UL62H1708BSK35
UL62H1708BSK35G1 Standard SRAM, 128KX8, 35ns, CMOS, PDSO32, 0.450 INCH, LEAD FREE, SOP-32 Alliance Memory Inc UL62H1708BSK35G1 vs UL62H1708BSK35G1
UL62H1708BSA35G1 Standard SRAM, 128KX8, 35ns, CMOS, PDSO32, 0.450 INCH, LEAD FREE, SOP-32 Alliance Memory Inc UL62H1708BSK35G1 vs UL62H1708BSA35G1
UL62H1708BSA35G1 Standard SRAM, 128KX8, 35ns, CMOS, PDSO32, 0.450 INCH, LEAD FREE, SOP-32 Simtek Corporation UL62H1708BSK35G1 vs UL62H1708BSA35G1
UL62H1708BSK35G1 Standard SRAM, 128KX8, 35ns, CMOS, PDSO32, 0.450 INCH, LEAD FREE, SOP-32 Simtek Corporation UL62H1708BSK35G1 vs UL62H1708BSK35G1
UL62H1708BSK35 Standard SRAM, 128KX8, 35ns, CMOS, PDSO32, 0.450 INCH, SOP-32 ZMDI UL62H1708BSK35G1 vs UL62H1708BSK35
UL62H1708BSK35G1 128KX8 STANDARD SRAM, 35ns, PDSO32, 0.450 INCH, LEAD FREE, SOP-32 Cypress Semiconductor UL62H1708BSK35G1 vs UL62H1708BSK35G1
UL62H1708BSA35 Standard SRAM, 128KX8, 35ns, CMOS, PDSO32, 0.450 INCH, SOP-32 Alliance Memory Inc UL62H1708BSK35G1 vs UL62H1708BSA35
UL62H1708BSA35 Standard SRAM, 128KX8, 35ns, CMOS, PDSO32, 0.450 INCH, SOP-32 ZMDI UL62H1708BSK35G1 vs UL62H1708BSA35
UL62H1708BSA35G1 128KX8 STANDARD SRAM, 35ns, PDSO32, 0.450 INCH, LEAD FREE, SOP-32 Cypress Semiconductor UL62H1708BSK35G1 vs UL62H1708BSA35G1
Part Number Description Manufacturer Compare
HM62Y8128DLTSI-12UL 128KX8 STANDARD SRAM, 120ns, PDSO32, 8 X 13.40 MM, PLASTIC, TSOP1-32 Renesas Electronics Corporation UL62H1708BSK35G1 vs HM62Y8128DLTSI-12UL
TC55V2001TR-10L IC 256K X 8 STANDARD SRAM, 100 ns, PDSO32, 8 X 20 MM, 0.50 MM PITCH, REVERSE, PLASTIC, TSOP1-32, Static RAM Toshiba America Electronic Components UL62H1708BSK35G1 vs TC55V2001TR-10L
8959836BZC Standard SRAM, 128KX8, 35ns, CMOS, CDIP32, 0.400 INCH, CERAMIC, DIP-32 Micross Components UL62H1708BSK35G1 vs 8959836BZC
WMS128K8-17CMA Standard SRAM, 128KX8, 17ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation UL62H1708BSK35G1 vs WMS128K8-17CMA
EDI88130CS25NB Standard SRAM, 128KX8, 25ns, CMOS, CDSO32, CERAMIC, SOJ-32 Microsemi Corporation UL62H1708BSK35G1 vs EDI88130CS25NB
8959808BUC Standard SRAM, 128KX8, 70ns, CMOS, CDSO32, CERAMIC, LCC-32 Micross Components UL62H1708BSK35G1 vs 8959808BUC
EDI88128CS35TM Standard SRAM, 128KX8, 35ns, CMOS, CDIP32, 0.400 INCH, SIDE BRAZED, CERAMIC, DIP-32 Microsemi Corporation UL62H1708BSK35G1 vs EDI88128CS35TM
TC518129AFTL-10 IC 128K X 8 PSEUDO STATIC RAM, 100 ns, PDSO32, 8 X 20 MM, PLASTIC, TSOP-32, Static RAM Toshiba America Electronic Components UL62H1708BSK35G1 vs TC518129AFTL-10
V62C2181024LL70R 128KX8 STANDARD SRAM, 70ns, PDSO32, 0.400 INCH, SOJ-32 Mosel Vitelic Corporation UL62H1708BSK35G1 vs V62C2181024LL70R
HM658128DP-15 Pseudo Static RAM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Hitachi Ltd UL62H1708BSK35G1 vs HM658128DP-15

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