Datasheets
U630H04BDK25 by:

Non-Volatile SRAM, 512X8, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28

Part Details for U630H04BDK25 by ZMDI

Overview of U630H04BDK25 by ZMDI

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Applications Space Technology Aerospace and Defense Energy and Power Systems

Part Details for U630H04BDK25

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U630H04BDK25 Part Data Attributes:

U630H04BDK25 ZMDI
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U630H04BDK25 ZMDI Non-Volatile SRAM, 512X8, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer ZENTRUM MIKROELEKTRONIK DRESDEN AG
Part Package Code DIP
Package Description DIP, DIP28,.3
Pin Count 28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 25 ns
JESD-30 Code R-PDIP-T28
JESD-609 Code e0
Length 34.7 mm
Memory Density 4096 bit
Memory IC Type NON-VOLATILE SRAM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 512 words
Number of Words Code 512
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 512X8
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP28,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.1 mm
Standby Current-Max 0.001 A
Supply Current-Max 0.095 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Alternate Parts for U630H04BDK25

This table gives cross-reference parts and alternative options found for U630H04BDK25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of U630H04BDK25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
U630H04BDK25 512X8 NON-VOLATILE SRAM, 25ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Cypress Semiconductor U630H04BDK25 vs U630H04BDK25
U630H04BDK25 Non-Volatile SRAM, 512X8, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Simtek Corporation U630H04BDK25 vs U630H04BDK25
Part Number Description Manufacturer Compare
X20C04D-20 Non-Volatile SRAM, 512X8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERDIP-28 Xicor Inc U630H04BDK25 vs X20C04D-20
X20C05JI-45T1 Non-Volatile SRAM, 512X8, 45ns, CMOS, PQCC32, PLASTIC, LCC-32 Xicor Inc U630H04BDK25 vs X20C05JI-45T1
U633H04BSK45 512X8 NON-VOLATILE SRAM, 45ns, PDSO28, 0.300 INCH, SOP-28 Cypress Semiconductor U630H04BDK25 vs U633H04BSK45
U633H04BD1C25G1 512X8 NON-VOLATILE SRAM, 25ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Cypress Semiconductor U630H04BDK25 vs U633H04BD1C25G1
U633H04BD1K25 512X8 NON-VOLATILE SRAM, 25ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Cypress Semiconductor U630H04BDK25 vs U633H04BD1K25
U630H04DK45 512X8 NON-VOLATILE SRAM, 45ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Cypress Semiconductor U630H04BDK25 vs U630H04DK45
U633H04D1C45G1 Non-Volatile SRAM, 512X8, 45ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Simtek Corporation U630H04BDK25 vs U633H04D1C45G1
U633H04BSK25G1 512X8 NON-VOLATILE SRAM, 25ns, PDSO24, 0.300 INCH, SOP-24 Cypress Semiconductor U630H04BDK25 vs U633H04BSK25G1
X2004DM-20 Non-Volatile SRAM, 512X8, 200ns, CMOS, CDIP28, HERMETIC SEALED, CERDIP-28 Xicor Inc U630H04BDK25 vs X2004DM-20
X20C05JM-35 Non-Volatile SRAM, 512X8, 35ns, CMOS, PQCC32, PLASTIC, LCC-32 Xicor Inc U630H04BDK25 vs X20C05JM-35

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