Part Details for U630H04BDK25 by ZMDI
Overview of U630H04BDK25 by ZMDI
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (2 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Space Technology
Aerospace and Defense
Energy and Power Systems
Part Details for U630H04BDK25
U630H04BDK25 CAD Models
U630H04BDK25 Part Data Attributes:
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U630H04BDK25
ZMDI
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Datasheet
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U630H04BDK25
ZMDI
Non-Volatile SRAM, 512X8, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | ZENTRUM MIKROELEKTRONIK DRESDEN AG | |
Part Package Code | DIP | |
Package Description | DIP, DIP28,.3 | |
Pin Count | 28 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 25 ns | |
JESD-30 Code | R-PDIP-T28 | |
JESD-609 Code | e0 | |
Length | 34.7 mm | |
Memory Density | 4096 bit | |
Memory IC Type | NON-VOLATILE SRAM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 512 words | |
Number of Words Code | 512 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 512X8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP28,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.1 mm | |
Standby Current-Max | 0.001 A | |
Supply Current-Max | 0.095 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 7.62 mm |
Alternate Parts for U630H04BDK25
This table gives cross-reference parts and alternative options found for U630H04BDK25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of U630H04BDK25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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U630H04BDK25 | 512X8 NON-VOLATILE SRAM, 25ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Cypress Semiconductor | U630H04BDK25 vs U630H04BDK25 |
U630H04BDK25 | Non-Volatile SRAM, 512X8, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 | Simtek Corporation | U630H04BDK25 vs U630H04BDK25 |