Part Details for TSPC860MHVGU/T40B by Teledyne e2v
Overview of TSPC860MHVGU/T40B by Teledyne e2v
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TSPC860MHVGU/T40B
TSPC860MHVGU/T40B CAD Models
TSPC860MHVGU/T40B Part Data Attributes
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TSPC860MHVGU/T40B
Teledyne e2v
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Datasheet
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TSPC860MHVGU/T40B
Teledyne e2v
Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ATMEL GRENOBLE | |
| Part Package Code | BGA | |
| Package Description | CERAMIC, BGA-357 | |
| Pin Count | 357 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 40 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B357 | |
| Low Power Mode | NO | |
| Number of Terminals | 357 | |
| Operating Temperature-Max | 110 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Speed | 40 MHz | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 3.135 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR |
Alternate Parts for TSPC860MHVGU/T40B
This table gives cross-reference parts and alternative options found for TSPC860MHVGU/T40B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC860MHVGU/T40B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TSPC860MHVGU50C | Microprocessor, 32-Bit, 50MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Teledyne e2v | TSPC860MHVGU/T40B vs TSPC860MHVGU50C |
| TSPC860MHMZPU40B | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TSPC860MHVGU/T40B vs TSPC860MHMZPU40B |
| TSPC860MHMZPU40A3 | Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TSPC860MHVGU/T40B vs TSPC860MHMZPU40A3 |
| XPC860ENZP50C1 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | TSPC860MHVGU/T40B vs XPC860ENZP50C1 |
| TS(X)PC860MHVZPU40(A) | RISC Microprocessor, 32-Bit, 40MHz, CMOS, PBGA357, PBGA, 357 PIN | Teledyne e2v | TSPC860MHVGU/T40B vs TS(X)PC860MHVZPU40(A) |
| XPC860ZP33 | RISC Microprocessor, 32-Bit, 33MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Motorola Semiconductor Products | TSPC860MHVGU/T40B vs XPC860ZP33 |
| TSPC860SRMZPU80D | RISC Microprocessor, 32-Bit, 80MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TSPC860MHVGU/T40B vs TSPC860SRMZPU80D |
| MPC860ENZP40 | 32-BIT, 40MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | TSPC860MHVGU/T40B vs MPC860ENZP40 |
| MPC8241LZP200B | RISC Microprocessor, 32-Bit, 200MHz, CMOS, PBGA357, 25 X 25 MM, 1.27 MM HEIGHT, PLASTIC, BGA-357 | Motorola Semiconductor Products | TSPC860MHVGU/T40B vs MPC8241LZP200B |
| TS(X)PC860MHVGU40A3 | Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Teledyne e2v | TSPC860MHVGU/T40B vs TS(X)PC860MHVGU40A3 |