Part Details for TSPC860MHMZP50C by Atmel Corporation
Overview of TSPC860MHMZP50C by Atmel Corporation
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Part Details for TSPC860MHMZP50C
TSPC860MHMZP50C CAD Models
TSPC860MHMZP50C Part Data Attributes:
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TSPC860MHMZP50C
Atmel Corporation
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TSPC860MHMZP50C
Atmel Corporation
Micro Peripheral IC, CBGA357
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ATMEL CORP | |
| Package Description | BGA, BGA357,19X19,50 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| JESD-30 Code | S-XBGA-B357 | |
| JESD-609 Code | e0 | |
| Number of Terminals | 357 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC | |
| Package Code | BGA | |
| Package Equivalence Code | BGA357,19X19,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Temperature Grade | MILITARY | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM |