Part Details for TSPC860MHMZP40C by Atmel Corporation
Overview of TSPC860MHMZP40C by Atmel Corporation
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Part Details for TSPC860MHMZP40C
TSPC860MHMZP40C CAD Models
TSPC860MHMZP40C Part Data Attributes:
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TSPC860MHMZP40C
Atmel Corporation
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TSPC860MHMZP40C
Atmel Corporation
Micro Peripheral IC, CBGA357
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ATMEL CORP | |
Package Description | BGA, BGA357,19X19,50 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.31.00.01 | |
JESD-30 Code | S-XBGA-B357 | |
JESD-609 Code | e0 | |
Number of Terminals | 357 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Package Body Material | CERAMIC | |
Package Code | BGA | |
Package Equivalence Code | BGA357,19X19,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Temperature Grade | MILITARY | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM |