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Overview of TSM2307CXRF by Taiwan Semiconductor
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Industrial Automation
Energy and Power Systems
Renewable Energy
CAD Models for TSM2307CXRF by Taiwan Semiconductor
Part Data Attributes for TSM2307CXRF by Taiwan Semiconductor
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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TAIWAN SEMICONDUCTOR CO LTD
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Package Description
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ROHS COMPLIANT PACKAGE-3
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Reach Compliance Code
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compliant
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ECCN Code
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EAR99
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Additional Feature
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ULTRA-LOW RESISTANCE
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Configuration
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SINGLE WITH BUILT-IN DIODE
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DS Breakdown Voltage-Min
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30 V
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Drain Current-Max (ID)
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3 A
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Drain-source On Resistance-Max
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0.08 Ω
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FET Technology
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METAL-OXIDE SEMICONDUCTOR
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JESD-30 Code
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R-PDSO-G3
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Number of Elements
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1
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Number of Terminals
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3
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Operating Mode
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ENHANCEMENT MODE
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Package Body Material
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PLASTIC/EPOXY
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Package Shape
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RECTANGULAR
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Package Style
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SMALL OUTLINE
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Polarity/Channel Type
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P-CHANNEL
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Pulsed Drain Current-Max (IDM)
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20 A
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Qualification Status
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Not Qualified
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Surface Mount
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YES
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Terminal Form
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GULL WING
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Terminal Position
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DUAL
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Transistor Application
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SWITCHING
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Transistor Element Material
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SILICON
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