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Microcontrollers and Processors / Bus Controllers / TSI721A1-16GILV
Datasheets
TSI721A1-16GILV by:
Renesas Electronics Corporation
Integrated Device Technology Inc
Renesas Electronics Corporation
Not Found

RapidIO Bridge, FCBGA160/Tray

Part Details for TSI721A1-16GILV by Renesas Electronics Corporation

Results Overview of TSI721A1-16GILV by Renesas Electronics Corporation

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Applications Computing and Data Storage

TSI721A1-16GILV Information

TSI721A1-16GILV by Renesas Electronics Corporation is a Bus Controller.
Bus Controllers are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Available Datasheets

Part # Manufacturer Description Datasheet
TSI721A1-16GILV Renesas Electronics Corporation RapidIO Bridge
TSI721A1-16GCLV Renesas Electronics Corporation RapidIO Bridge
TSI721A1-16GCLY Renesas Electronics Corporation RapidIO Bridge

Price & Stock for TSI721A1-16GILV

Part # Distributor Description Stock Price Buy
DISTI # 800-3761-ND
DigiKey IC INTFACE SPECIALIZED 143FCBGA Lead time: 12 Weeks Container: Tray Temporarily Out of Stock
Buy Now
DISTI # TSI721A1-16GILV
Avnet Americas RID - Trays (Alt: TSI721A1-16GILV) RoHS: Compliant Min Qty: 160 Package Multiple: 160 Lead time: 12 Weeks, 0 Days Container: Tray 0
  • 1 $450.2900
$450.2900 Buy Now
DISTI # 972-TSI721A1-16GILV
Mouser Electronics PCI Interface IC PCIe-to-Rapid IO Bridge RoHS: Compliant 0
  • 160 $465.9900
$465.9900 Order Now
Future Electronics IC RAPIDIO SW PCI BRDG 143FCBGA RoHS: Compliant pbFree: Yes Min Qty: 160 Package Multiple: 160 Lead time: 12 Weeks Container: Tray 0
Tray
  • 160 $429.9800
$429.9800 Buy Now
DISTI # TSI721A1-16GILV
Avnet Silica RID (Alt: TSI721A1-16GILV) RoHS: Compliant Min Qty: 160 Package Multiple: 160 Lead time: 13 Weeks, 0 Days Silica - 0
Buy Now
Win Source Electronics IC INTFACE SPECIALIZED 143FCBGA 462
  • 1 $196.7857
  • 2 $176.4286
$176.4286 / $196.7857 Buy Now

Part Details for TSI721A1-16GILV

TSI721A1-16GILV CAD Models

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TSI721A1-16GILV Part Data Attributes

Parametric Data
TSI721A1-16GILV Renesas Electronics Corporation
Buy Now Datasheet
Compare Parts:
TSI721A1-16GILV Renesas Electronics Corporation RapidIO Bridge, FCBGA160/Tray
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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer RENESAS ELECTRONICS CORP
Part Package Code FCBGA
Pin Count 143
Manufacturer Package Code HMG143
Reach Compliance Code compliant
ECCN Code NLR
HTS Code 8542390001
Factory Lead Time 12 Weeks
Samacsys Manufacturer Renesas Electronics

Alternate Parts for TSI721A1-16GILV

This table gives cross-reference parts and alternative options found for TSI721A1-16GILV. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSI721A1-16GILV, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
TSI721A1-16GCLY Integrated Device Technology Inc Check for Price FCBGA-143, Tray TSI721A1-16GILV vs TSI721A1-16GCLY
TSI721A1-16GILY Integrated Device Technology Inc Check for Price FCBGA-143, Tray TSI721A1-16GILV vs TSI721A1-16GILY

TSI721A1-16GILV Related Parts

TSI721A1-16GILV Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.

  • Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal gradients. Also, consider using thermal protection circuits and over-temperature protection.

  • Use a multi-layer PCB with a solid ground plane, and ensure that high-frequency signals are routed away from sensitive analog circuits. Also, consider using EMI filters and shielding to minimize radiation.

  • Use the device's power-down modes, adjust the clock frequency, and optimize the voltage regulator settings to minimize power consumption. Also, consider using low-power modes and dynamic voltage scaling.

  • Perform functional testing, including boundary scan and JTAG testing. Also, validate the device's performance using simulation tools and bench testing, and ensure compliance with relevant industry standards.