Part Details for TSI381-66IL by Integrated Device Technology Inc
Overview of TSI381-66IL by Integrated Device Technology Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| TSI381-RDK1 V2.0 | Renesas Electronics Corporation | Evaluation Board SDK for the Tsi381 | |
| TSI381-RDK1 V2.1 | Renesas Electronics Corporation | Evaluation Board SDK for the Tsi381 | |
| TSI381-RDK2 V1.0 | Renesas Electronics Corporation | Evaluation Board SDK for the Tsi381 |
Price & Stock for TSI381-66IL
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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Flip Electronics | Stock | 10357 |
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RFQ |
Part Details for TSI381-66IL
TSI381-66IL CAD Models
TSI381-66IL Part Data Attributes
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TSI381-66IL
Integrated Device Technology Inc
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Datasheet
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TSI381-66IL
Integrated Device Technology Inc
CABGA-144, Tray
|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | CABGA | |
| Package Description | BGA-144 | |
| Pin Count | 144 | |
| Manufacturer Package Code | BC144 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Address Bus Width | 32 | |
| Bus Compatibility | PCI | |
| Clock Frequency-Max | 66 MHz | |
| Drive Interface Standard | IEEE 1149.6; IEEE 1149.1 | |
| External Data Bus Width | 32 | |
| JESD-30 Code | S-PBGA-B144 | |
| JESD-609 Code | e0 | |
| Length | 13 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 144 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.8 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 13 mm | |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, PCI |