Part Details for TSI108-200CLY by Integrated Device Technology Inc
Overview of TSI108-200CLY by Integrated Device Technology Inc
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- Part Data Attributes: (Available)
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Part Details for TSI108-200CLY
TSI108-200CLY CAD Models
TSI108-200CLY Part Data Attributes
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TSI108-200CLY
Integrated Device Technology Inc
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Datasheet
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TSI108-200CLY
Integrated Device Technology Inc
FCBGA-1023, Tray
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | FCBGA | |
| Package Description | BGA-1023 | |
| Pin Count | 1023 | |
| Manufacturer Package Code | RM1023 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Bus Compatibility | POWERPC 60X | |
| Clock Frequency-Max | 33.33 MHz | |
| JESD-30 Code | S-PBGA-B1023 | |
| JESD-609 Code | e1 | |
| Length | 33 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of Terminals | 1023 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.76 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 33 mm | |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, PCI |