Part Details for TSB12LV22PZP by Texas Instruments
Overview of TSB12LV22PZP by Texas Instruments
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Electronic Manufacturing
Entertainment and Gaming
Part Details for TSB12LV22PZP
TSB12LV22PZP CAD Models
TSB12LV22PZP Part Data Attributes
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TSB12LV22PZP
Texas Instruments
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TSB12LV22PZP
Texas Instruments
SPECIALTY MICROPROCESSOR CIRCUIT, PQFP100
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Package Description | HTFQFP, QFP100,.63SQ,20 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.31.00.01 | |
JESD-30 Code | S-PQFP-G100 | |
Length | 14 mm | |
Number of Terminals | 100 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | HTFQFP | |
Package Equivalence Code | QFP100,.63SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 14 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |