Part Details for TS(X)PC860MHMZP50B by Thales Group
Overview of TS(X)PC860MHMZP50B by Thales Group
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TS(X)PC860MHMZP50B
TS(X)PC860MHMZP50B CAD Models
TS(X)PC860MHMZP50B Part Data Attributes
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TS(X)PC860MHMZP50B
Thales Group
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Datasheet
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TS(X)PC860MHMZP50B
Thales Group
RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357
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Part Life Cycle Code | Transferred | |
Ihs Manufacturer | THOMSON-CSF SEMICONDUCTORS | |
Part Package Code | BGA | |
Package Description | , | |
Pin Count | 357 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 50 MHz | |
External Data Bus Width | 32 | |
Format | FIXED POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B357 | |
Low Power Mode | NO | |
Number of Terminals | 357 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Speed | 50 MHz | |
Supply Voltage-Max | 3.465 V | |
Supply Voltage-Min | 3.135 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | BALL | |
Terminal Position | BOTTOM | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TS(X)PC860MHMZP50B
This table gives cross-reference parts and alternative options found for TS(X)PC860MHMZP50B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TS(X)PC860MHMZP50B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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XPC860SRCZP66D4 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | TS(X)PC860MHMZP50B vs XPC860SRCZP66D4 |
TS(X)PC860MHMZPB/Q50A3 | Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Thales Group | TS(X)PC860MHMZP50B vs TS(X)PC860MHMZPB/Q50A3 |
XPC860SRZP50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | TS(X)PC860MHMZP50B vs XPC860SRZP50D4 |
TS(X)PC860MHMGU/T40B | Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Thales Group | TS(X)PC860MHMZP50B vs TS(X)PC860MHMGU/T40B |
MPC860TVR50D4 | PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, 0 to 95C | Freescale Semiconductor | TS(X)PC860MHMZP50B vs MPC860TVR50D4 |
TSPC860MHMGB/Q40A3 | Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Thales Group | TS(X)PC860MHMZP50B vs TSPC860MHMGB/Q40A3 |
MPC860DECZQ50D4 | PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, HDLC, PCMCIA, -40 to 95C | Freescale Semiconductor | TS(X)PC860MHMZP50B vs MPC860DECZQ50D4 |
TS(X)PC860MHMZP50B | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Teledyne e2v | TS(X)PC860MHMZP50B vs TS(X)PC860MHMZP50B |
MPC860TVR50D4R2 | PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, 0 to 95C | Freescale Semiconductor | TS(X)PC860MHMZP50B vs MPC860TVR50D4R2 |
TSPC860MHVGB/Q40A3 | Microprocessor, 32-Bit, 40MHz, CMOS, CBGA357, CERAMIC, BGA-357 | Thales Group | TS(X)PC860MHMZP50B vs TSPC860MHVGB/Q40A3 |