Part Details for TNETX3150AGGP by Texas Instruments
Overview of TNETX3150AGGP by Texas Instruments
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for TNETX3150AGGP
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 3 |
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RFQ | ||
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Chip 1 Exchange | INSTOCK | 1208 |
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RFQ |
Part Details for TNETX3150AGGP
TNETX3150AGGP CAD Models
TNETX3150AGGP Part Data Attributes:
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TNETX3150AGGP
Texas Instruments
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Datasheet
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TNETX3150AGGP
Texas Instruments
DATACOM, NETWORK INTERFACE SUPPORT CIRCUIT, PBGA352, PLASTIC, BGA-352
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | BGA | |
| Package Description | PLASTIC, BGA-352 | |
| Pin Count | 352 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PBGA-B352 | |
| Length | 35 mm | |
| Number of Functions | 1 | |
| Number of Terminals | 352 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA352,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.7 mm | |
| Supply Current-Max | 0.55 mA | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Telecom IC Type | SUPPORT CIRCUIT | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 35 mm |