Part Details for TMSDM6467CCUTV6TAN by Texas Instruments
Results Overview of TMSDM6467CCUTV6TAN by Texas Instruments
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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TMSDM6467CCUTV6TAN Information
TMSDM6467CCUTV6TAN by Texas Instruments is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for TMSDM6467CCUTV6TAN
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
TMSDM6467CCUTV6TAN-ND
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DigiKey | IC SOC DIGITAL MEDIA 529FCBGA Min Qty: 84 Lead time: 26 Weeks Container: Tray | Limited Supply - Call |
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$96.1001 | Buy Now |
Part Details for TMSDM6467CCUTV6TAN
TMSDM6467CCUTV6TAN CAD Models
TMSDM6467CCUTV6TAN Part Data Attributes
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TMSDM6467CCUTV6TAN
Texas Instruments
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Datasheet
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TMSDM6467CCUTV6TAN
Texas Instruments
Digital Media System-on-Chip 529-FCBGA
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Package Description | FCBGA-529 | |
Reach Compliance Code | compliant | |
JESD-30 Code | S-PBGA-B529 | |
JESD-609 Code | e1 | |
Length | 19 mm | |
Moisture Sensitivity Level | 4 | |
Number of Terminals | 529 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Peak Reflow Temperature (Cel) | 245 | |
Seated Height-Max | 3.3 mm | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 19 mm | |
uPs/uCs/Peripheral ICs Type | Digital Media SoC |