-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
Low power C55x fixed point DSP- up to 200MHz, USB, LCD interface, FFT HWA, SAR ADC 196-NFBGA -40 to 85
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
296-TMS32C5517AZCHA20RTR-ND
|
DigiKey | IC DSP FLOATING POINT Min Qty: 1000 Lead time: 6 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
|
$7.4177 | Buy Now |
DISTI #
595-32C5517AZCHA20R
|
Mouser Electronics | Digital Signal Processors & Controllers - DSP, DSC Low power C55x fixed point DSP- up to 200MHz, USB, LCD interface, FFT HWA, SAR ADC 196-NFBGA -40 to 85 RoHS: Compliant | 427 |
|
$7.3900 / $11.7100 | Buy Now |
|
Ameya Holding Limited | 6944 |
|
RFQ | ||
|
LCSC | - Digital Signal Processors / Controllers (DSPs/DSCs) ROHS | 4 |
|
$14.3541 / $17.6543 | Buy Now |
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
|
TMS32C5517AZCHA20R
Texas Instruments
Buy Now
Datasheet
|
Compare Parts:
TMS32C5517AZCHA20R
Texas Instruments
Low power C55x fixed point DSP- up to 200MHz, USB, LCD interface, FFT HWA, SAR ADC 196-NFBGA -40 to 85
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Package Description | NFBGA-196 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | Texas Instruments | |
Address Bus Width | 21 | |
Barrel Shifter | NO | |
Boundary Scan | YES | |
External Data Bus Width | 16 | |
Format | FIXED POINT | |
Internal Bus Architecture | MULTIPLE | |
JESD-30 Code | S-PBGA-B196 | |
JESD-609 Code | e1 | |
Length | 10 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 196 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.3 mm | |
Supply Voltage-Max | 1.15 V | |
Supply Voltage-Min | 0.998 V | |
Supply Voltage-Nom | 1.05 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.65 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 10 mm | |
uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |