Part Details for TMS320VC5416GWS160 by Texas Instruments
Overview of TMS320VC5416GWS160 by Texas Instruments
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for TMS320VC5416GWS160
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
296-TMS320VC5416GWS160-ND
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DigiKey | DIGITAL SIGNAL PROCESSOR Min Qty: 160 Lead time: 6 Weeks Container: Tray | Temporarily Out of Stock |
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$42.3578 | Buy Now |
DISTI #
595-S320VC5416GWS160
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Mouser Electronics | Digital Signal Processors & Controllers - DSP, DSC Digital Signal Processor 144-NFBGA -40 to 85 RoHS: Not Compliant | 2 |
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$41.9500 / $52.2900 | Buy Now |
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Ameya Holding Limited | 478 |
|
RFQ |
Part Details for TMS320VC5416GWS160
TMS320VC5416GWS160 CAD Models
TMS320VC5416GWS160 Part Data Attributes:
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TMS320VC5416GWS160
Texas Instruments
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Datasheet
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TMS320VC5416GWS160
Texas Instruments
Digital Signal Processor 144-NFBGA -40 to 85
|
Pbfree Code | Yes | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Package Description | NFBGA-144 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Date Of Intro | 2020-05-31 | |
Address Bus Width | 23 | |
Barrel Shifter | YES | |
Bit Size | 16 | |
Boundary Scan | YES | |
Clock Frequency-Max | 20 MHz | |
External Data Bus Width | 16 | |
Format | FIXED POINT | |
Integrated Cache | NO | |
Internal Bus Architecture | MULTIPLE | |
JESD-30 Code | S-PBGA-B144 | |
JESD-609 Code | e0 | |
Length | 12 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of DMA Channels | 6 | |
Number of External Interrupts | 4 | |
Number of Terminals | 144 | |
Number of Timers | 1 | |
On Chip Data RAM Width | 16 | |
On Chip Program ROM Width | 16 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA144,13X13,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 220 | |
RAM (words) | 131072 | |
ROM Programmability | MROM | |
Seated Height-Max | 1.4 mm | |
Supply Voltage-Max | 1.65 V | |
Supply Voltage-Min | 1.55 V | |
Supply Voltage-Nom | 1.6 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Width | 12 mm | |
uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |