Part Details for TMS320DM355ZCE270 by Texas Instruments
Overview of TMS320DM355ZCE270 by Texas Instruments
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for TMS320DM355ZCE270
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
2156-TMS320DM355ZCE270-TI-ND
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DigiKey | IC DIGITAL MEDIA SOC 337-NFBGA Min Qty: 9 Lead time: 18 Weeks Container: Tray MARKETPLACE PRODUCT |
7630 In Stock |
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$34.5900 | Buy Now |
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DISTI #
296-23302-ND
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DigiKey | IC DIGITAL MEDIA SOC 337-NFBGA Min Qty: 9 Lead time: 18 Weeks Container: Tray | Temporarily Out of Stock |
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$35.0660 | Buy Now |
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DISTI #
595-MS320DM355ZCE270
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Mouser Electronics | Digital Signal Processors & Controllers - DSP, DSC Digital Media System on Chip RoHS: Compliant | 0 |
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Order Now | |
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Rochester Electronics | TMS320DM355 - ARM9 Digital Media Processor, 32-Bit, MPEG/JPEG Coprocessor, PBGA337 RoHS: Compliant Status: Not Recommended for New Designs Min Qty: 1 | 7630 |
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$29.6800 / $34.9200 | Buy Now |
Part Details for TMS320DM355ZCE270
TMS320DM355ZCE270 CAD Models
TMS320DM355ZCE270 Part Data Attributes
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TMS320DM355ZCE270
Texas Instruments
Buy Now
Datasheet
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TMS320DM355ZCE270
Texas Instruments
SPECIALTY MICROPROCESSOR CIRCUIT, PBGA337, 13 X 13 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-337
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
| Part Package Code | BGA | |
| Package Description | 13 X 13 MM, 0.65 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-337 | |
| Pin Count | 337 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Bit Size | 32 | |
| Format | FIXED POINT | |
| JESD-30 Code | S-PBGA-B337 | |
| JESD-609 Code | e1 | |
| Length | 13 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 337 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA337,19X19,25 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (words) | 32768 | |
| Seated Height-Max | 1.3 mm | |
| Supply Voltage-Max | 1.365 V | |
| Supply Voltage-Min | 1.235 V | |
| Supply Voltage-Nom | 1.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 13 mm | |
| uPs/uCs/Peripheral ICs Type | Digital Media SoC |